H05K 1/0306
Inorganic insulating substrates
Official title: {Inorganic insulating substrates, e.g. ceramic, glass}
H05K1/0306 (Inorganic insulating substrates) appears on 4,142 US grants and 3,667 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,142
- Published applications
- 3,667
- Assignees
- 1,180
- Inventors
- 8,114
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 16 | 0 |
| 1978 | 16 | 0 |
| 1979 | 6 | 0 |
| 1980 | 14 | 0 |
| 1981 | 24 | 0 |
| 1982 | 42 | 0 |
| 1983 | 25 | 0 |
| 1984 | 35 | 0 |
| 1985 | 49 | 0 |
| 1986 | 53 | 0 |
| 1987 | 56 | 0 |
| 1988 | 69 | 0 |
| 1989 | 96 | 0 |
| 1990 | 78 | 0 |
| 1991 | 69 | 0 |
| 1992 | 100 | 0 |
| 1993 | 72 | 0 |
| 1994 | 72 | 0 |
| 1995 | 74 | 0 |
| 1996 | 63 | 0 |
| 1997 | 85 | 0 |
| 1998 | 83 | 0 |
| 1999 | 95 | 0 |
| 2000 | 69 | 0 |
| 2001 | 100 | 43 |
| 2002 | 119 | 154 |
| 2003 | 123 | 137 |
| 2004 | 125 | 151 |
| 2005 | 94 | 147 |
| 2006 | 91 | 152 |
| 2007 | 88 | 132 |
| 2008 | 92 | 125 |
| 2009 | 69 | 172 |
| 2010 | 112 | 133 |
| 2011 | 96 | 92 |
| 2012 | 105 | 73 |
| 2013 | 78 | 126 |
| 2014 | 79 | 157 |
| 2015 | 129 | 213 |
| 2016 | 138 | 140 |
| 2017 | 151 | 135 |
| 2018 | 123 | 141 |
| 2019 | 146 | 147 |
| 2020 | 121 | 145 |
| 2021 | 103 | 136 |
| 2022 | 85 | 135 |
| 2023 | 109 | 137 |
| 2024 | 109 | 152 |
| 2025 | 105 | 151 |
| 2026 | 75 | 241 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,957 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Printed circuit board15 Sep 2026US 12,739,975 B2Samsung Electro-Mechanics Co., Ltd.
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
- Ceramic circuit board and manufacturing method therefor1 Oct 2026US 2026/0304591 A1Niterra Materials Co., Ltd.
- Wiring board1 Oct 2026US 2026/0304612 A1KYOCERA Corporation
- Substrate1 Oct 2026US 2026/0304617 A1KYOCERA Corporation
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Method of forming copper/copper alloy interconnection with reduced electromigration316US 6,242,349 B1Advanced Micro Devices, Inc. · 2001
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996