H05K 1/05
Insulated conductive substrates
Official title: Insulated {conductive substrates, e.g. insulated} metal substrate
H05K1/05 (Insulated conductive substrates) appears on 1,976 US grants and 1,949 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,976
- Published applications
- 1,949
- Assignees
- 776
- Inventors
- 4,073
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 7 | 0 |
| 1981 | 11 | 0 |
| 1982 | 13 | 0 |
| 1983 | 12 | 0 |
| 1984 | 11 | 0 |
| 1985 | 18 | 0 |
| 1986 | 17 | 0 |
| 1987 | 21 | 0 |
| 1988 | 22 | 0 |
| 1989 | 27 | 0 |
| 1990 | 31 | 0 |
| 1991 | 29 | 0 |
| 1992 | 26 | 0 |
| 1993 | 24 | 0 |
| 1994 | 25 | 0 |
| 1995 | 17 | 0 |
| 1996 | 27 | 0 |
| 1997 | 24 | 0 |
| 1998 | 38 | 0 |
| 1999 | 39 | 0 |
| 2000 | 20 | 0 |
| 2001 | 45 | 9 |
| 2002 | 42 | 36 |
| 2003 | 32 | 46 |
| 2004 | 41 | 54 |
| 2005 | 34 | 72 |
| 2006 | 46 | 90 |
| 2007 | 49 | 92 |
| 2008 | 42 | 94 |
| 2009 | 52 | 131 |
| 2010 | 62 | 108 |
| 2011 | 88 | 93 |
| 2012 | 90 | 87 |
| 2013 | 70 | 100 |
| 2014 | 80 | 93 |
| 2015 | 64 | 111 |
| 2016 | 82 | 87 |
| 2017 | 74 | 79 |
| 2018 | 70 | 81 |
| 2019 | 88 | 54 |
| 2020 | 57 | 75 |
| 2021 | 55 | 73 |
| 2022 | 43 | 53 |
| 2023 | 44 | 85 |
| 2024 | 55 | 76 |
| 2025 | 60 | 40 |
| 2026 | 41 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Bulb-type light source18 Aug 2026US 12,710,143 B2Seoul Semiconductor Co., Ltd.
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- EMC filter device having an integrated current sensor and an integrated capacitor; and power electronics module18 Aug 2026US 12,712,514 B2Schaeffler Technologies AG & Co. KG
- Conductive substrate and manufacturing method thereof1 Oct 2026US 2026/0304616 A1DeepWave, Inc.
- Multilayer substrate and electronic device17 Sep 2026US 2026/0280090 A1Murata Manufacturing Co., Ltd.
- Multiphase system comprising power converter27 Aug 2026US 2026/0254352 A1Mitsubishi Electric Corporation
- Resin-clad metal foil, method for manufacturing printed wiring board, and method for manufacturing semiconductor package20 Aug 2026US 2026/0242612 A1Resonac Corporation
- Method for producing an smd semiconductor assembly populated with a circuit carrier, smd semiconductor assembly, and circuit carrier20 Aug 2026US 2026/0247992 A1iCuTech - Anlagenbau GmbH
Most cited
By later US patents
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002
- LED illumination apparatus and card-type LED illumination source287US 6,949,772 B2Matsushita Electric Industrial Co., Ltd. · 2005
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997