H05K 1/056
The metal substrate being covered by an organic insulating layer
Official title: {the metal substrate being covered by an organic insulating layer}
H05K1/056 (The metal substrate being covered by an organic insulating layer) appears on 1,209 US grants and 1,253 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,209
- Published applications
- 1,253
- Assignees
- 459
- Inventors
- 2,410
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 10 | 0 |
| 1989 | 12 | 0 |
| 1990 | 16 | 0 |
| 1991 | 11 | 0 |
| 1992 | 9 | 0 |
| 1993 | 8 | 0 |
| 1994 | 13 | 0 |
| 1995 | 9 | 0 |
| 1996 | 16 | 0 |
| 1997 | 16 | 0 |
| 1998 | 22 | 0 |
| 1999 | 20 | 0 |
| 2000 | 11 | 0 |
| 2001 | 35 | 9 |
| 2002 | 33 | 29 |
| 2003 | 25 | 37 |
| 2004 | 37 | 44 |
| 2005 | 27 | 57 |
| 2006 | 38 | 72 |
| 2007 | 38 | 75 |
| 2008 | 37 | 69 |
| 2009 | 40 | 99 |
| 2010 | 53 | 81 |
| 2011 | 62 | 54 |
| 2012 | 72 | 58 |
| 2013 | 52 | 56 |
| 2014 | 53 | 57 |
| 2015 | 39 | 73 |
| 2016 | 48 | 45 |
| 2017 | 45 | 41 |
| 2018 | 38 | 41 |
| 2019 | 41 | 30 |
| 2020 | 32 | 41 |
| 2021 | 27 | 41 |
| 2022 | 25 | 34 |
| 2023 | 18 | 40 |
| 2024 | 29 | 37 |
| 2025 | 28 | 14 |
| 2026 | 21 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010