Back to results
US 2026/0173260 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsAkane KOMORI, Hayato TAKAKURA, Ryosuke SASAOKA
Life of this patent
Estimating the term…
Abstract
A wiring circuit board includes a metal supporting layer, a first insulating layer, a first wire, and a second wire. The first wire has a first outer edge and a first inner edge. The second wire has a second outer edge and a second inner edge. At least one of the first outer edge and the second outer edge does not overlap with the metal supporting layer in the thickness direction. The first inner edge and the second inner edge overlap with the metal supporting layer in the thickness direction.
Claims6
A wiring circuit board, comprising:
- an insulating layer;
- a first wire being disposed at one side of the insulating layer in a thickness direction of the insulating layer;
- a second wire being disposed at one side of the insulating layer in the thickness direction and disposed so as to be spaced apart from the first wire in a width direction orthogonal to the thickness direction;
- and
- a metal supporting layer being disposed at the other side of the insulating layer in the thickness direction,
- the first wire having, in the width direction, a first outer edge, and a first inner edge disposed between the first outer edge and the second wire,
- the second wire having, in the width direction, a second outer edge, and a second inner edge disposed between the second outer edge and the first wire,
- at least one of the first outer edge and the second outer edge not overlapping with the metal supporting layer in the thickness direction, and
- the first inner edge and the second inner edge overlapping with the metal supporting layer in the thickness direction.
6 more elements
Dependencies are inferred from the claim text.