H05K 1/053
The metal substrate being covered by an inorganic insulating layer
Official title: {the metal substrate being covered by an inorganic insulating layer}
H05K1/053 (The metal substrate being covered by an inorganic insulating layer) appears on 392 US grants and 355 published applications in this corpus.
Search patents in H05K- Granted patents
- 392
- Published applications
- 355
- Assignees
- 251
- Inventors
- 1,002
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 12 | 0 |
| 1986 | 6 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 14 | 0 |
| 1991 | 11 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 13 | 0 |
| 2000 | 2 | 0 |
| 2001 | 9 | 1 |
| 2002 | 5 | 5 |
| 2003 | 4 | 6 |
| 2004 | 4 | 11 |
| 2005 | 6 | 12 |
| 2006 | 8 | 13 |
| 2007 | 11 | 18 |
| 2008 | 3 | 23 |
| 2009 | 7 | 32 |
| 2010 | 7 | 19 |
| 2011 | 22 | 31 |
| 2012 | 17 | 19 |
| 2013 | 9 | 14 |
| 2014 | 14 | 19 |
| 2015 | 12 | 25 |
| 2016 | 17 | 21 |
| 2017 | 14 | 15 |
| 2018 | 12 | 11 |
| 2019 | 13 | 9 |
| 2020 | 10 | 7 |
| 2021 | 9 | 10 |
| 2022 | 5 | 7 |
| 2023 | 7 | 7 |
| 2024 | 8 | 8 |
| 2025 | 4 | 10 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- EMC filter device having an integrated current sensor and an integrated capacitor; and power electronics module18 Aug 2026US 12,712,514 B2Schaeffler Technologies AG & Co. KG
- Device for thermal conduction and electrical isolation18 Aug 2026US 12,713,528 B2Nitride Global Inc.
- Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate25 Nov 2025US 12,482,739 B2Siemens Aktiengesellschaft
- Printed circuit board and method of manufacturing the same21 Oct 2025US 12,453,012 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board7 Oct 2025US 12,439,512 B2Samsung Electro-Mechanics Co., Ltd.
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
- Manufacturing of electric circuits on insulating coatings22 Jan 2026US 2026/0025929 A1Oerlikon Am Europe GmbH
- Semiconductor device25 Dec 2025US 2025/0391777 A1
- Printed circuit board and method of manufacturing the same25 Dec 2025US 2025/0393132 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring circuit board18 Dec 2025US 2025/0386430 A1Nitto Denko Corporation
Most cited
By later US patents
- Illumination system148US 7,165,863 B12007
- Method for the manufacture of multilayer printed circuit boards136US 4,897,338 AAllied-Signal Inc. · 1990
- High heat conductive insulated substrate and method of manufacturing the same118US 4,783,368 AKanegafuchi Kagaku Kogyo Kabushiki Kaisha · 1988
- Semiconductor package104US 5,014,159 AOlin Corporation · 1991
- Process for manufacturing hollow multilayer printed wiring board103US 4,528,072 AFujitsu Limited · 1985