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US 12,453,012 B2Granted
Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDo Jae Yoo, Yong Gil Namgung, Jong Hoon Shin, Won Ju Jang, Yun Hwan Kim
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.
Claims24
A printed circuit board (PCB) comprising:
- a solder resist layer including at least one of an opening and a depression, wherein the opening and the depression each are recessed from a portion of an upper surface of the solder resist layer towards a lower surface of the solder resist layer such that the upper surface and each of the opening and the depression have an edge;
- and
- a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression,
- wherein the portion of the upper surface of the solder resist layer is exposed from the solder resist patch.
1 more element
A printed circuit board (PCB) comprising:
- an insulating layer;
- a conductive layer disposed on the insulating layer;
- and
- a solder resist structure constituting a solder resist layer and having at least one concave portion located on at least a portion of the conductive layer on an upper surface of the solder resist layer,
- wherein an average of the center thickness of the at least one concave portion is greater than 10% and less than 70% of a thickness of a portion not overlapping the at least one concave portion in the solder resist structure.
2 more elements
A method for manufacturing a printed circuit board (PCB), the method comprising:
- curing a solder resist layer of an unfinished PCB;
- obtaining thickness and size measurement values of a plurality of points of the solder resist layer;
- filling a solder resist material at a point corresponding to a thickness and size measurement value falling within a target range, among the thickness and size measurement values of the plurality of points;
- and
- curing the point filled with the solder resist material, among the plurality of points, and measuring and checking whether a thickness and size of the filled point after curing fall within the target range.
2 more elements
A printed circuit board (PCB) comprising:
- an insulating layer;
- a conductive layer disposed on the insulating layer and including a first conductive pattern and a second conductive pattern;
- and
- a solder resist structure comprising a solder resist layer and a solder resist pattern,
- wherein a property of the solder resist pattern is different from a property of the solder resist layer,
- the solder resist layer covers a portion of the insulating layer and has an opening exposing a portion of the first conductive pattern, and
- the solder resist pattern is disposed on the second conductive pattern and is in contact with the solder resist layer.
4 more elements
Dependencies are inferred from the claim text.