US 4,528,072 A · Process for manufacturing hollow multilayer printed wiring board · patentgrep

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Abstract

A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween. Each of the substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof. Each substrate has plated through holes in the land conductor pattern, each of which holes is in line with another plated through hole of at least one of the neighboring substrates to form a continuous through hole or an interstitial through hole. A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plated through holes. This layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation-treated metal.

Claims27

Dependent claims

A process for manufacturing a hollow multilayer printed wiring board comprising the steps of:

preparing printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said printed substrate has a signal conductor pattern on at least one surface thereof and a land conductor pattern on at least one surface thereof, and further so that each said substrate has a layer of a low melting point metal formed on said land conductor pattern;
superposing the printed substrates one upon another so that the land conductor pattern having the low melting point metal layer of each substrate is in contact with the land conductor pattern or patterns having the low melting point metal layer of at least one adjacent substrate;
applying pressure and heat sufficient for melt-adhering the substrates having the low melting point metal layer to the at least one adjacent substrate, so that there is a space between the signal conductor pattern and the adjacent substrate;
and
boring through holes in the substrate and the melt-adhered land conductor patterns of the superposed substrates, and forming plated conductor layers on at least the inner walls of the through holes to form plated through holes serving as an electrical connection between at least two signal conductor patterns of the superposed printed substrates.

2 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof, so that each said substrate has plated through holes in the land conductor pattern, the plated through holes being defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and in the exposed portions of the conductor foils formed on the substrate;
(iii) electroplating the exposed portions of the conductor foils formed on the substrate to form electroplated conductor layers on the regions on which the signal conductor pattern and the land conductor pattern are to be formed and on the inner wall of each of the through holes;
(iv) plating the electroplated conductor layers with a low melting point metal to form layers of the low melting point metal on at least the electroplated conductor layers formed on the upper and lower land portions of each of the through holes;
(v) removing the resist from the conductor foils formed on the substrate;
and
(vi) etching the substrate to remove the exposed portions of the conductor foils;
superposing said printed substrates upon each other so that each of the plated through holes is in line with other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

8 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof, so that each said substrate has plated through holes in the land conductor pattern, the plated through holes being defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and in the exposed portions of the conductor foils formed on the substrate;
(iii) electroplating the exposed portions of the conductor foils formed on the substrate to form electroplated conductor layers on the regions on which the signal conductor pattern and the land conductor pattern are to be formed and on the inner wall of each of the through holes;
(iv) removing the resist from the electroplated substrate;
(v) etching the substrate to remove the exposed portions of the conductor foils;
and
(vi) forming layers of a low melting point metal on at least the upper and lower ground portions of each of the through holes;
superposing said printed substrates upon each other so that each of the plated through holes is in line with other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

8 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) electroplating the exposed portions of the conductor foils formed on the substrate to form electroplated conductor layers on the region on which the signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(iv) plating the electroplated conductor layers with a low melting point metal to form layers of the low melting point metal on at least the electroplated conductor layers formed on the upper and lower end portions of each of the through holes;
(v) removing the resist from the conductor foils formed on the substrate;
and
(vi) etching the substrate to remove the exposed portions of the conductor foils;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

8 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) electroplating the exposed portions of the conductor foils formed on the substrate to form electroplated conductor layers on the region on which the signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(iv) removing the resist from the electroplated substrate;
(v) etching the substrate to remove the exposed portions of the conductor foils;
and
(vi) forming layers of a low melting point metal on at least the upper and lower end portions of each of the through holes;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

8 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet of an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) subjecting the substrate to electroless plating to form an electroless-plated conductor layer on the exposed portions of the substrate, the resist, and the inner walls of the through holes;
(iv) removing the uppermost and lowermost portions of the electroless-plated conductor layer to expose the uppermost and lowermost portions of the resist;
(v) electroplating the resist-exposed substrate to form electroplated conductor layers in the region on which the signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(vi) plating the electroplated conductor layers with a low melting point metal to form layers of the low melting point metal on at least the electroplated conductor layers formed on the upper and lower end portions of each of the through holes;
(vii) removing the resist from the substrate;
and
(viii) etching the substrate to remove the exposed portions of the electroless-plated conductor layer;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

10 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating with a resist a substrate having conductor foils formed on both surfaces thereof, and patterning the resist to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) subjecting the substrate to electroless plating to form an electroless-plated conductor layer on the exposed portions of the substrate, the resist, and the inner walls of the through holes;
(iv) removing the uppermost and lowermost portions of the electroless-plated conductor layer to expose the uppermost and lowermost portions of the resist;
(v) electroplating the resist-exposed substrate to form electroplating conductor layers on the region on which a signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(vi) removing the resist from the electroplated substrate;
(vii) etching the substrate to remove the exposed portions of the electroless-plated conductor layer;
and
(viii) forming layers of a low melting point metal on at least the upper and lower end portions of each of the through holes with a low melting point metal;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

10 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating a substrate having conductor foils formed on both surfaces thereof, with a first resist, onto which a conductor is capable of being deposited by electroless plating and then, with a second resist formed on the first resist, onto which a conductor is incapable of being deposited by electroless plating, and patterning the first and second resists to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) subjecting the substrate to electroless plating to form conductor layers on the exposed pattern of the second resist on the region on which the signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(iv) electroplating the substrate to form electroplated conductor layers on the electroless-plated conductor layers;
(v) plating the electroplated conductor layers with a low melting point metal to form layers of the low melting point metal on at least the electroplated conductor layers formed on the upper and lower end portions of each of the through holes;
(vi) removing the first and second resists from the conductor foils formed on the substrate;
and
(vii) etching the substrate to remove the exposed portions of the conductor foils;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

9 more elements

A process for manufacturing a hollow multilayer printed wiring board which comprises the steps of:

preparing a plurality of printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation-treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said substrate has a signal conductor pattern formed on at least one surface thereof, so that each substrate has plated through holes defined by plating layers having upper and lower end surfaces, and further so that a layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plating layers, said preparing step comprising the substeps of:
(i) laminating a substrate having conductor foils formed on both surfaces thereof, with a first resist, onto which a conductor is capable of being deposited by electroless plating and then, with a second resist formed on the first resist, onto which a conductor is incapable of being deposited by electroless plating, and patterning the first and second resists to form a resist pattern;
(ii) boring through holes in the substrate and the resist formed on the substrate;
(iii) subjecting the substrate to electroless plating to form electroless-plated conductor layers in accordance with the pattern of the second resist on the region on which the signal conductor pattern is to be formed and on the inner wall of each of the through holes;
(iv) electroplating the substrate to form electroplated conductor layers on the electroless-plated conductor layers;
(v) removing the first and second resists from the conductor foils formed on the substrate;
(vi) etching the substrate to remove the exposed portions of the conductor foils;
and
(vii) forming layers of a low melting point metal on at least the upper and lower end portions of each of the through holes;
superposing said printed substrates upon each other so that each of the plated through holes is in line with the other plated through holes of at least one of the adjacent printed substrates;
and
applying pressure and heat sufficient for melt-adhering and electrically connecting the substrate having the low melting point metal layer to at least one adjacent substrate by way of the plated through holes, so that there is a space between the signal conductor pattern and the adjacent substrate.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 06/393,324Filed 29 Jun 1982 · division
Priority: JP 54-6432924 May 1979
Granted: 9 Jul 1985
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

H05K 3/462
The electrical connections between the circuit boards being made during lamination: characterized by laminating only or mainly similar…
H05K 3/429
Plated through-holes or plated via connections: plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit…
H05K 1/0272
Details: adaptations for fluid transport, e.g. channels, holes
H05K 1/053
Insulated conductive substrates, e.g. insulated metal substrate: the metal substrate being covered by an inorganic insulating layer

Family

Serial229,594Parent of this division · filed 16 Jan 1981
US 4,368,503 AParent of this division
US 4,528,072 AThis patent

From the US filing history. Foreign family members aren’t listed.

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