H05K 1/0313
Organic insulating material
Official title: {Organic insulating material}
H05K1/0313 (Organic insulating material) appears on 5,292 US grants and 5,584 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,292
- Published applications
- 5,584
- Assignees
- 1,644
- Inventors
- 11,088
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 17 | 0 |
| 1978 | 19 | 0 |
| 1979 | 11 | 0 |
| 1980 | 15 | 0 |
| 1981 | 16 | 0 |
| 1982 | 26 | 0 |
| 1983 | 33 | 0 |
| 1984 | 29 | 0 |
| 1985 | 41 | 0 |
| 1986 | 36 | 0 |
| 1987 | 60 | 0 |
| 1988 | 70 | 0 |
| 1989 | 96 | 0 |
| 1990 | 105 | 0 |
| 1991 | 98 | 0 |
| 1992 | 111 | 0 |
| 1993 | 110 | 0 |
| 1994 | 103 | 0 |
| 1995 | 78 | 0 |
| 1996 | 68 | 0 |
| 1997 | 68 | 0 |
| 1998 | 88 | 0 |
| 1999 | 82 | 0 |
| 2000 | 68 | 0 |
| 2001 | 107 | 36 |
| 2002 | 108 | 146 |
| 2003 | 122 | 161 |
| 2004 | 116 | 182 |
| 2005 | 84 | 186 |
| 2006 | 103 | 176 |
| 2007 | 89 | 203 |
| 2008 | 88 | 196 |
| 2009 | 84 | 250 |
| 2010 | 121 | 238 |
| 2011 | 113 | 169 |
| 2012 | 142 | 167 |
| 2013 | 122 | 169 |
| 2014 | 110 | 235 |
| 2015 | 142 | 321 |
| 2016 | 205 | 324 |
| 2017 | 229 | 274 |
| 2018 | 222 | 269 |
| 2019 | 252 | 261 |
| 2020 | 229 | 266 |
| 2021 | 191 | 250 |
| 2022 | 197 | 264 |
| 2023 | 178 | 229 |
| 2024 | 189 | 256 |
| 2025 | 177 | 198 |
| 2026 | 106 | 158 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board6 Oct 2026US 12,753,301 B2Panasonic Intellectual Property Management Co., Ltd.
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Organic substrate for placing components of a camera6 Oct 2026US 12,756,912 B1Apple Inc.
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Resin composition, film, metal-clad laminate, and circuit board8 Oct 2026US 2026/0308452 A1Kuraray Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Insulation film and printed circuit board comprising same1 Oct 2026US 2026/0297376 A1LG Chem.Ltd.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013