H05K 1/032
Consisting of one material
Official title: {consisting of one material}
H05K1/032 (Consisting of one material) appears on 2,112 US grants and 1,901 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,112
- Published applications
- 1,901
- Assignees
- 767
- Inventors
- 4,850
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 9 | 0 |
| 1978 | 10 | 0 |
| 1979 | 8 | 0 |
| 1980 | 9 | 0 |
| 1981 | 8 | 0 |
| 1982 | 17 | 0 |
| 1983 | 21 | 0 |
| 1984 | 19 | 0 |
| 1985 | 19 | 0 |
| 1986 | 20 | 0 |
| 1987 | 27 | 0 |
| 1988 | 39 | 0 |
| 1989 | 59 | 0 |
| 1990 | 67 | 0 |
| 1991 | 61 | 0 |
| 1992 | 62 | 0 |
| 1993 | 73 | 0 |
| 1994 | 60 | 0 |
| 1995 | 48 | 0 |
| 1996 | 30 | 0 |
| 1997 | 29 | 0 |
| 1998 | 41 | 0 |
| 1999 | 30 | 0 |
| 2000 | 33 | 0 |
| 2001 | 51 | 16 |
| 2002 | 60 | 58 |
| 2003 | 55 | 70 |
| 2004 | 50 | 80 |
| 2005 | 41 | 71 |
| 2006 | 43 | 82 |
| 2007 | 41 | 85 |
| 2008 | 35 | 78 |
| 2009 | 32 | 91 |
| 2010 | 35 | 78 |
| 2011 | 29 | 55 |
| 2012 | 48 | 55 |
| 2013 | 43 | 56 |
| 2014 | 34 | 60 |
| 2015 | 46 | 108 |
| 2016 | 63 | 110 |
| 2017 | 65 | 84 |
| 2018 | 70 | 77 |
| 2019 | 87 | 75 |
| 2020 | 64 | 75 |
| 2021 | 49 | 80 |
| 2022 | 51 | 101 |
| 2023 | 53 | 92 |
| 2024 | 76 | 80 |
| 2025 | 52 | 44 |
| 2026 | 33 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board22 Sep 2026US 12,742,047 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition and article made therefrom15 Sep 2026US 12,735,522 B2Elite Electronic Material (Kunshan) Co., Ltd.
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Flexible polytetrafluoroethylene substrate with electrical circuit layer and method therefor1 Sep 2026US 12,722,167 B2
- Polyimide film, high-frequency circuit substrate, and flexible electronic device substrate1 Sep 2026US 12,723,132 B2Ube Corporation
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
- Component Carrier With Porous Body, and Manufacture Method1 Oct 2026US 2026/0304615 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Forming a circuit bearing structure with dielectric ink1 Oct 2026US 2026/0304646 A1LCP Medical Technologies, Inc.
- Printed wiring board17 Sep 2026US 2026/0282219 A1Sumitomo Electric Printed Circuits, Inc.
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board10 Sep 2026US 2026/0265436 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Strong, air permeable membranes of polytetrafluoroethylene209US 5,814,405 AW. L. Gore & Associates, Inc. · 1998
- Strip line cable using a porous, crystalline polymer dielectric tape131US 4,382,236 AJunkosha Inc. · 1983
- Formaldehyde-free, accelerated cure, aqueous composition for bonding glass fiber heat-resistant nonwovens129US 5,977,232 ARohm and Haas Company · 1999