Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board

A resin composition comprising:

• a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.;
• and
• a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less;
• wherein the maleimide compound (A) includes a maleimide compound (A2) having an indane structure in a molecule.