Printed wiring board

Abstract

The printed wiring board includes a base film having a main surface, a conductive pattern disposed on the main surface, and a coverlay including an adhesive layer disposed on the main surface so as to cover the conductive pattern and an insulating film disposed on the adhesive layer. The conductive pattern has a terminal portion. The coverlay is formed with an opening that penetrates the coverlay to expose an upper surface of the terminal portion. When an edge of the opening on a lower surface of the adhesive layer is defined as a first opening edge and an edge of the opening on a lower surface of the insulating film is defined as a second opening edge, a resin flow width (a distance between the first opening edge and the second opening edge) is 30% or less of a minimum value of a width of the first opening edge.

Dependencies are inferred from the claim text.