Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsYan Zhang, Tianyu Cai, Diya Liu
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Abstract
The present disclosure provides a resin composition and an article made therefrom, and the article comprises a prepreg, a resin film, a laminate, or a printed circuit board. The resin composition comprises (A) 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and (B) 20 parts by weight to 60 parts by weight of a phosphorus-containing compound represented by Formula (1). The article has an improvement in at least one or more or all of the glass transition temperature, the dielectric constant, the dissipation factor, the flame retardancy, the percent thermal expansion at Z-axis, the water absorption rate, the interlayer bonding strength, and alkali resistance.
Claims9
A resin composition, comprising:
- (A) 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin;
- and
- (B) 20 parts by weight to 60 parts by weight of a phosphorus-containing compound represented by Formula (1),
- wherein in Formula (1), each of X is independently a group represented by Formula (2), Formula (3) or Formula (4), Y is a covalent bond or a C1 to C3 alkyl group, and each of R is independently a group represented by Formula (5) or Formula (6),
- wherein each of R1 to R33 is independently a hydrogen atom or a C1 to C3 alkyl group, and each of Q is independently a covalent bond or a C1 to C3 alkyl group.
Dependencies are inferred from the claim text.