H05K 1/0326
Containing o
Official title: {containing O}
H05K1/0326 (Containing o) appears on 693 US grants and 673 published applications in this corpus.
Search patents in H05K- Granted patents
- 693
- Published applications
- 673
- Assignees
- 339
- Inventors
- 1,746
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 7 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 22 | 0 |
| 1990 | 16 | 0 |
| 1991 | 14 | 0 |
| 1992 | 10 | 0 |
| 1993 | 14 | 0 |
| 1994 | 13 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 15 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 18 | 4 |
| 2002 | 17 | 27 |
| 2003 | 26 | 21 |
| 2004 | 21 | 29 |
| 2005 | 11 | 24 |
| 2006 | 11 | 18 |
| 2007 | 12 | 20 |
| 2008 | 13 | 24 |
| 2009 | 16 | 16 |
| 2010 | 10 | 22 |
| 2011 | 14 | 22 |
| 2012 | 9 | 15 |
| 2013 | 11 | 16 |
| 2014 | 8 | 26 |
| 2015 | 16 | 44 |
| 2016 | 26 | 47 |
| 2017 | 29 | 38 |
| 2018 | 30 | 36 |
| 2019 | 35 | 35 |
| 2020 | 38 | 37 |
| 2021 | 28 | 37 |
| 2022 | 17 | 32 |
| 2023 | 15 | 35 |
| 2024 | 27 | 20 |
| 2025 | 13 | 10 |
| 2026 | 10 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition and article made therefrom15 Sep 2026US 12,735,522 B2Elite Electronic Material (Kunshan) Co., Ltd.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Resin sheet28 Jul 2026US 12,692,384 B2Ajinomoto Co., Inc.
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board2 Jun 2026US 12,643,972 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device5 May 2026US 12,617,986 B2Ajinomoto Co., Inc.
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
- Printed wiring board17 Sep 2026US 2026/0282219 A1Sumitomo Electric Printed Circuits, Inc.
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board10 Sep 2026US 2026/0265436 A1Panasonic Intellectual Property Management Co., Ltd.
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Phosphorus-containing (meth)acryloyl compound, phosphorus-containing vinyl benzyl compound, production methods therefor, and flame-retardant resin composition and laminated board for electronic circuit board containing same13 Aug 2026US 2026/0234170 A1Nippon Steel Chemical & Material Co., Ltd.
Most cited
By later US patents
- Formaldehyde-free, accelerated cure, aqueous composition for bonding glass fiber heat-resistant nonwovens129US 5,977,232 ARohm and Haas Company · 1999
- Control motor integrated with a direct current motor and a speed control circuit100US 5,119,466 AASMO Co.LTD · 1992
- Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom94US 6,812,276 B2General Electric Company · 2004
- Poly(phenylene ether)-polyvinyl thermosetting resin82US 6,352,782 B1General Electric Company · 2002
- Flexible electronic structure81US 9,159,635 B2MC10, Inc. · 2015