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US 12,617,986 B2Granted
Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device
AssigneeAjinomoto Co., Inc.
InventorKenji Kawai
Life of this patent
Estimating the term…
Abstract
Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.
Claims19
A method for producing an insulating layer on an inner layer substrate, comprising:
- (I) laminating a resin sheet on said inner layer substrate so as to bond a resin composition layer of said resin sheet with said inner layer substrate, and
- (II) curing said resin composition layer, thereby forming said insulating layer;
- wherein said resin composition layer comprises a resin composition comprising
- (A) at least one naphthol aralkyl epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq or more;
- and
- (B) at least one curing agent, wherein
- (B) said curing agent comprises (B-1) an active ester curing agent;
- and
- the insulating layer has a dielectric loss tangent less than 0.005 measured at a frequency of 5.8 GHz and a temperature of 23° C.
6 more elements
Dependencies are inferred from the claim text.