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US 12,643,972 B2Granted
Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHiroaki Umehara, Hirosuke Saito
Life of this patent
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Abstract
A resin composition contains a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the terminal, a maleimide compound (A) having an indane structure in the molecule, and an inorganic filler.
Claims17
A resin composition comprising:
- a polyphenylene ether compound having a carbon-carbon unsaturated double bond at a terminal;
- a maleimide compound (A) having an indane structure in a molecule;
- a curing agent that reacts with at least one of the polyphenylene ether compound and the maleimide compound (A);
- and
- an inorganic filler,
- wherein the curing agent includes an N-alkyl bismaleimide compound having a weight average molecular weight of 689 or more, and
- a content of the curing agent is 5 to 25 parts by mass with respect to 100 parts by mass of a total mass of the polyphenylene ether compound and the maleimide compound (A).
4 more elements
Dependencies are inferred from the claim text.