Back to results
US 12,692,384 B2Granted
Resin sheet
AssigneeAjinomoto Co., Inc.
InventorShu Ikehira
Life of this patent
Estimating the term…
Abstract
A resin sheet including a support and a resin composition layer formed on the support, in which the resin composition layer contains (A) an epoxy resin, (B) an organic solvent, (C) an inorganic filler, and (D) a stress relaxing material, in which a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in the range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, can suppress an irregularity after lamination and a warpage after curing.
Claims25
A resin sheet-comprising:
- a support;
- and
- at least one resin composition layer formed on the support, wherein
- the resin composition layer comprises (A) at least one epoxy resin, (B) at least one organic solvent, (C) at least one inorganic filler, and (D) at least one stress relaxing material, and
- a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in a range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, and
- a product of a value of a content (% by mass) of the (C) component and a value of a specific surface area (m2/g) of the (C) component, when nonvolatile components in the resin composition layer account for 100% by mass, is 414 or more.
3 more elements
A resin composition comprising:
- (A) an epoxy resin;
- (B) an organic solvent;
- (C) an inorganic filler;
- and
- (D) a stress relaxing material, wherein
- a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in a range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, and
- a product of a value of a content (% by mass) of the (C) component and a value of a specific surface area (m2/g) of the (C) component, when nonvolatile components in the resin composition layer account for 100% by mass, is 414 or more.
4 more elements
A resin sheet comprising:
- a support, and
- at least one resin composition layer formed on the support, wherein
- the resin composition layer comprises (A) at least one epoxy resin, (B) at least one organic solvent, (C) at least one inorganic filler, and (D) at least one stress relaxing material, and
- a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in a range of 0 to 9% by mass relative to 100% by mass of total of the (B) component,
- wherein a dielectric loss tangent (Df) of the resin composition layer after curing is 0.0090 or less when measured at 10 GHz and 23° C.
2 more elements
A resin composition comprising:
- (A) an epoxy resin;
- (B) an organic solvent;
- (C) an inorganic filler;
- and
- (D) a stress relaxing material, wherein
- a content of an aromatic solvent having a boiling point of lower than:
- 120° C. in the (B) component is in a range of 0 to 9% by mass relative to 100% by mass of total of the (B) component,
- wherein a dielectric loss tangent (Df) of the resin composition layer after curing is 0.0090 or less when measured at 10 GHz and 23° C.
5 more elements
Dependencies are inferred from the claim text.