H05K 1/0346
Containing n
Official title: {containing N}
H05K1/0346 (Containing n) appears on 980 US grants and 910 published applications in this corpus.
Search patents in H05K- Granted patents
- 980
- Published applications
- 910
- Assignees
- 412
- Inventors
- 2,520
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 8 | 0 |
| 1983 | 9 | 0 |
| 1984 | 11 | 0 |
| 1985 | 8 | 0 |
| 1986 | 11 | 0 |
| 1987 | 15 | 0 |
| 1988 | 15 | 0 |
| 1989 | 27 | 0 |
| 1990 | 27 | 0 |
| 1991 | 28 | 0 |
| 1992 | 32 | 0 |
| 1993 | 33 | 0 |
| 1994 | 33 | 0 |
| 1995 | 27 | 0 |
| 1996 | 18 | 0 |
| 1997 | 17 | 0 |
| 1998 | 16 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 22 | 7 |
| 2002 | 29 | 26 |
| 2003 | 22 | 41 |
| 2004 | 23 | 42 |
| 2005 | 22 | 36 |
| 2006 | 26 | 47 |
| 2007 | 20 | 50 |
| 2008 | 16 | 41 |
| 2009 | 12 | 63 |
| 2010 | 19 | 41 |
| 2011 | 12 | 23 |
| 2012 | 28 | 34 |
| 2013 | 22 | 27 |
| 2014 | 14 | 25 |
| 2015 | 21 | 48 |
| 2016 | 30 | 49 |
| 2017 | 28 | 38 |
| 2018 | 31 | 36 |
| 2019 | 39 | 38 |
| 2020 | 31 | 24 |
| 2021 | 19 | 27 |
| 2022 | 24 | 41 |
| 2023 | 27 | 40 |
| 2024 | 23 | 38 |
| 2025 | 22 | 13 |
| 2026 | 13 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board22 Sep 2026US 12,742,047 B2Panasonic Intellectual Property Management Co., Ltd.
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Polyimide film, high-frequency circuit substrate, and flexible electronic device substrate1 Sep 2026US 12,723,132 B2Ube Corporation
- Resin composition18 Aug 2026US 12,709,682 B2Ajinomoto Co., Inc.
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board13 Aug 2026US 2026/0234331 A1Mitsubishi Gas Chemical Company, Inc.
- Resin composition and uses of the same13 Aug 2026US 2026/0234399 A1Taiwan Union Technology Corporation
Most cited
By later US patents
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Formaldehyde-free, accelerated cure, aqueous composition for bonding glass fiber heat-resistant nonwovens129US 5,977,232 ARohm and Haas Company · 1999
- Process for making a foamed elastomeric polymer122US 5,804,607 AInternational Business Machines Corporation · 1998
- Process for making a foamed elastometric polymer104US 5,726,211 AInternational Business Machines Corporation · 1998