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US 2026/0234399 A1Published application
Resin composition and uses of the same
AssigneeTaiwan Union Technology Corporation
InventorChun-Kai LIN
Life of this patent
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Abstract
A resin composition is provided. The resin composition includes (A) a bismaleimide resin, (B) a cyanate ester resin with a number average molecular weight ranging from 1000 to 3000, and (C) a benzoxazine compound. A prepreg prepared from the resin composition, a metal-clad laminate prepared from the prepreg and a printed circuit board prepared from the metal-clad laminate are also provided.
Claims20
A resin composition, which comprises:
- (A) a bismaleimide resin;
- (B) a cyanate ester resin with a number average molecular weight ranging from 1000 to 3000;
- and
- (C) a benzoxazine compound.
1 more element
Dependencies are inferred from the claim text.