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US 2026/0234331 A1Published application
Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsYuji YAMAGATA, Tatsuro TAKAMURA, Yuta TAWARA, Naoki KASHIMA, Takaaki OGASHIWA
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Abstract
A resin composition containing: a filler (A), a maleimide compound (B1), and a dispersing agent (C), wherein a polar solubility parameter (δP) in terms of a Hansen solubility parameter of the dispersing agent (C) is 0.0 MPa0.5 or more and 10.0 MPa0.5 or less.
Claims19
A resin composition comprising:
- a filler (A);
- a maleimide compound (B1);
- and
- a dispersing agent (C),
- wherein a polar solubility parameter (δP) in terms of a Hansen solubility parameter of the dispersing agent (C) is 0.0 MPa0.5 or more and 10.0 MPa0.5 or less.
2 more elements
Dependencies are inferred from the claim text.