H05K 1/0333
Containing s
Official title: {containing S}
H05K1/0333 (Containing s) appears on 104 US grants and 32 published applications in this corpus.
Search patents in H05K- Granted patents
- 104
- Published applications
- 32
- Assignees
- 59
- Inventors
- 215
- Latest grant
- 6 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 2 | 2 |
| 2015 | 1 | 4 |
| 2016 | 3 | 5 |
| 2017 | 2 | 2 |
| 2018 | 2 | 1 |
| 2019 | 1 | 4 |
| 2020 | 3 | 4 |
| 2021 | 3 | 2 |
| 2022 | 3 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Composite structure and manufacturing method thereof6 May 2025US 12,291,605 B2DIC Corporation
- Electronic component and method for manufacturing electronic component27 Aug 2024US 12,070,800 B2Resonac Corporation
- Active ester resin and composition and cured product using the same10 Jan 2023US 11,548,977 B2DIC Corporation
- Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board13 Sep 2022US 11,445,605 B2TDK Corporation
- Epoxy resin composition5 Apr 2022US 11,292,872 B2Sumitomo Seika Chemicals Co., Ltd.
- Electronic component and method for manufacturing electronic component21 Nov 2024US 2024/0383035 A1Resonac Corporation
- Composite structure and manufacturing method thereof9 Feb 2023US 2023/0040667 A1DIC Corporation
- Electronic component and method for manufacturing electronic component17 Feb 2022US 2022/0053647 A1Showa Denko Materials Co., Ltd.
- Circuit board and method for manufacturing circuit board2 Dec 2021US 2021/0378105 A1Autonetworks Technologies, Ltd.
- Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board14 Jan 2021US 2021/0014966 A1TDK Corporation
Most cited
By later US patents
- Laminar polymeric sheet42US 5,194,316 ARaychem Corporation · 1993
- Method for increasing the peel strength of metal-clad polymers38US 4,337,279 AUop LLC · 1982
- Polyarylene sulfide resin composition31US 4,748,169 ADainippon Ink and Chemicals, Inc. · 1988
- Polyphenylenesulfide resin composition28US 4,395,512 AShin-Etsu Chemical Co., Ltd. · 1983
- Uses of uniaxially electrically conductive articles23US 5,678,287 ARaychem Corporation · 1997