Polyarylene sulfide resin composition
AssigneeDainippon Ink and Chemicals, Inc.
InventorsHitoshi Izutsu, Toshihide Yamaguchi
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Abstract
A polyarylene sulfide resin composition comprising (A) 100 parts by weight of a polyarylene sulfide resin, (B) 0.01 to 30 parts of a polymer containing a fluoro-aliphatic group and having affinity for the resin (A) and a graft or block copolymer having affinity for the resin (A) and hydrophilicity and (C) 0 to 600 parts by weight of a filler. The composition is suitable for use as an encapsulation on material for electronic component parts and a coating agent.
Claims7
A polyarylene sulfide resin composition useful for encapsulating electronic components by injection-molding, as a coating composition, or for molding into printed circuit boards, said composition comprising:
- (A) 100 parts by weight of polyarylene sulfide resin,
- (B) 0.01 to 30 parts by weight of a polymer containing a fluoroaliphatic group and having affinity for the resin (A), said polymer (B) being a random, block or graft copolymer of an unsaturated monomer containing a fluoroaliphatic group represented by the general formula
- (Rf--.sub.n X--A 1
- wherein Rf represents a fluoroaliphatic group having 3 to 20 carbon atoms, X is ##STR11## R represents H or a hydrocarbon group having 1 to 10 carbon atoms, l is 1 to 10 and n is 1 or 2, and an unsaturated monomer containing an organic group having affinity for the resin (A), and
- (C) 0 to 600 parts by weight of a filler.
An encapsulated electronic component comprising an electronic component encapsulated within an injection-molded composition comprising
- (A) 100 parts by weight of polyarylene sulfide resin,
- (B) 0.01to 30 parts by weight of a polymer containing a fluoroaliphatic group and having affinity for the resin (A), said polymer (B) being a random, block or graft copolymer of an unsaturated monomer containing a fluoroaliphatic group represented by the general formula
- (Rf--.sub.n X--A
- wherein Rf represents a fluoroaliphatic group having 3 to 20 carbon atoms, X is ##STR12## R represents H or a hydrocarbon group having 1 to 10 carbon atoms, l is 1 to 10 and n is 1 or 2, and an unsaturated monomer containing an organic group having affinity for the resin (A), and
- (C) 0 to 600 parts by weight of a filler.
A printed circuit board molded with a composition comprising:
- (A) 100 parts by weight of polyarylene sulfide resin,
- (B) 0.01 to 30 parts by weight of a polymer containing a fluoroaliphatic group and having affinity for the resin (A), said polymer (B) being a random, block or graft compolymer of an unsaturated monomer containing a fluoroaliphatic group represented by the general formula
- (Rf--.sub.n X--A
- wherein Rf represents a fluoroaliphatic group having 3 to 20 carbon atoms, X is ##STR13## R represents H or a hydrocarbon group having 1 to 10 carbon atoms, l is 1 to 10 and n is 1 or 2, and an unsaturated monomer containing an organic group having affinity for the resin (A), and
- (C) 0 to 600 parts by weight of a filler.
Dependencies are inferred from the claim text.