US 2022/0053647 A1 · ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Abstract

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Claims18

Dependent claims

A method for manufacturing an electronic component, the method comprising:

a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer;
a second step of sintering the metal particles to form a metal wiring;
a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer;
a fourth step of disposing an electronic element on the solder paste layer;
and
a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/274,788Filed 5 Sep 2019

Priority

JP 2018-17233214 Sep 2018

Published

17 Feb 2022

Term ends

Not estimatedThe source records don’t support an estimate.

Classification26 codes

B22F 7/08
Of composite workpieces or articles from parts, e.g. to form tipped tools: with one or more parts not made from powder
B22F 1/052
Metallic powder characterised by the size or surface area of the particles: characterised by a mixture of particles of different sizes or by the…
B22F 3/11
Sintering only: making porous workpieces or articles
B22F 5/12
Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product: of wires

Electronic component and method for manufacturing electronic component

Life of this patent

Electronic component and method for manufacturing electronic component

Life of this patent

Abstract

Claims18