Electronic component and method for manufacturing electronic component

A method for manufacturing an electronic component, the method comprising:

• a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer;
• a second step of sintering the metal particles to form a metal wiring;
• a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer;
• a fourth step of disposing an electronic element on the solder paste layer;
• and
• a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer, wherein the solder layer covers a side surface of the metal wiring,
• wherein the metal particles comprises first copper particles having a particle diameter of 2.0 μm or more and second copper particles having a particle diameter of 0.8 μm or less;
• and
• wherein the polymer compact is made of a liquid crystal polymer or polyphenylene sulfide.