H05K 1/0353
Consisting of two or more materials
Official title: {consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement}
H05K1/0353 (Consisting of two or more materials) appears on 3,373 US grants and 3,882 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,373
- Published applications
- 3,882
- Assignees
- 1,215
- Inventors
- 7,705
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 9 | 0 |
| 1978 | 13 | 0 |
| 1979 | 4 | 0 |
| 1980 | 8 | 0 |
| 1981 | 14 | 0 |
| 1982 | 18 | 0 |
| 1983 | 19 | 0 |
| 1984 | 18 | 0 |
| 1985 | 26 | 0 |
| 1986 | 21 | 0 |
| 1987 | 34 | 0 |
| 1988 | 35 | 0 |
| 1989 | 47 | 0 |
| 1990 | 50 | 0 |
| 1991 | 50 | 0 |
| 1992 | 62 | 0 |
| 1993 | 45 | 0 |
| 1994 | 58 | 0 |
| 1995 | 37 | 0 |
| 1996 | 43 | 0 |
| 1997 | 49 | 0 |
| 1998 | 49 | 0 |
| 1999 | 57 | 0 |
| 2000 | 42 | 0 |
| 2001 | 67 | 26 |
| 2002 | 56 | 88 |
| 2003 | 69 | 89 |
| 2004 | 67 | 95 |
| 2005 | 41 | 125 |
| 2006 | 61 | 113 |
| 2007 | 52 | 128 |
| 2008 | 54 | 140 |
| 2009 | 56 | 173 |
| 2010 | 82 | 166 |
| 2011 | 84 | 124 |
| 2012 | 107 | 126 |
| 2013 | 83 | 117 |
| 2014 | 79 | 181 |
| 2015 | 88 | 207 |
| 2016 | 132 | 217 |
| 2017 | 154 | 187 |
| 2018 | 147 | 190 |
| 2019 | 166 | 186 |
| 2020 | 160 | 196 |
| 2021 | 139 | 170 |
| 2022 | 140 | 186 |
| 2023 | 129 | 165 |
| 2024 | 129 | 198 |
| 2025 | 134 | 160 |
| 2026 | 76 | 129 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board6 Oct 2026US 12,753,301 B2Panasonic Intellectual Property Management Co., Ltd.
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board22 Sep 2026US 12,742,047 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, film, metal-clad laminate, and circuit board8 Oct 2026US 2026/0308452 A1Kuraray Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Insulation film and printed circuit board comprising same1 Oct 2026US 2026/0297376 A1LG Chem.Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Luminescent gel coats and moldable resins190US 6,207,077 B1Orion 21 A.D. PTY LTD · 2001