H05K 1/0373
Containing additives
Official title: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
H05K1/0373 (Containing additives) appears on 1,482 US grants and 1,839 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,482
- Published applications
- 1,839
- Assignees
- 628
- Inventors
- 3,859
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 8 | 0 |
| 1983 | 6 | 0 |
| 1984 | 8 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 20 | 0 |
| 1990 | 18 | 0 |
| 1991 | 20 | 0 |
| 1992 | 23 | 0 |
| 1993 | 18 | 0 |
| 1994 | 32 | 0 |
| 1995 | 19 | 0 |
| 1996 | 25 | 0 |
| 1997 | 22 | 0 |
| 1998 | 19 | 0 |
| 1999 | 22 | 0 |
| 2000 | 18 | 0 |
| 2001 | 37 | 15 |
| 2002 | 26 | 41 |
| 2003 | 33 | 41 |
| 2004 | 28 | 42 |
| 2005 | 15 | 62 |
| 2006 | 31 | 51 |
| 2007 | 25 | 53 |
| 2008 | 28 | 75 |
| 2009 | 26 | 75 |
| 2010 | 39 | 85 |
| 2011 | 31 | 50 |
| 2012 | 34 | 54 |
| 2013 | 31 | 48 |
| 2014 | 29 | 94 |
| 2015 | 34 | 111 |
| 2016 | 61 | 110 |
| 2017 | 73 | 97 |
| 2018 | 84 | 103 |
| 2019 | 81 | 89 |
| 2020 | 66 | 89 |
| 2021 | 76 | 74 |
| 2022 | 58 | 80 |
| 2023 | 62 | 71 |
| 2024 | 60 | 86 |
| 2025 | 49 | 75 |
| 2026 | 37 | 68 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable film composition, curable film, and cured product thereof22 Sep 2026US 12,742,059 B2Thintronics, Inc.
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Micro light-emitting package11 Aug 2026US 12,707,562 B2Ennostar Corporation
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Insulation film and printed circuit board comprising same1 Oct 2026US 2026/0297376 A1LG Chem.Ltd.
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
- Prepreg, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264370 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Luminescent gel coats and moldable resins190US 6,207,077 B1Orion 21 A.D. PTY LTD · 2001
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Process for making a foamed polymer155US 5,700,844 AInternational Business Machines Corporation · 1997