Curable film composition, curable film, and cured product thereof

A curable film composition, comprising:

• (A) hollow glass microspheres, which have D50 of equal to or less than 19.5 μm and are not subjected to an acid or alkaline wash before incorporation into the curable film composition;
• and
• (B) a rubber composition containing at least one diene-based rubber, and optionally at least one liquid rubber and at least one poly(arylene ether),
• wherein
• with the proviso that the rubber composition contains the at least one poly(arylene ether), an amount of the at least one poly(arylene ether) is 15 wt % or less based on a total weight of the rubber composition;
• and
• a cured film obtained from the curable film composition has a dielectric constant at 10 GHz of equal to or less than 2.5 and a Tg of 150° C. or less.

A curable film composition, comprising:

• (A) fillers in an amount of 10 wt % to 80 wt %, relative to a total weight of the curable film composition,
• (B) a rubber composition containing at least one diene-based rubber, and optionally at least one liquid rubber and at least one poly(arylene ether), and
• (C) a maleimide resin having a solubility in toluene of at least 5 g/100 ml at ambient temperature,
• wherein
• with the proviso that the rubber composition contains the at least one poly(arylene ether), an amount of the at least one poly(arylene ether) is 15 wt % or less based on a total weight of the rubber composition;
• and
• a cured film obtained from the curable film composition has a Tg of 150° C. or less.