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US 2026/0297376 A1Published application
Insulation film and printed circuit board comprising same
AssigneeLG Chem, Ltd.
InventorsBokyung KIM, Jun Wuk PARK, Tae Soon KIM, Youngsik YOON, Seongmin HWANG
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Abstract
The present specification provides insulation film and a printed circuit board comprising same, the insulation film comprising: a first layer comprising epoxy-based resin, a cyanate ester-based resin, and an inorganic filler surface-treated with phenylamino silane; and a second layer comprising epoxy-based resin, phenol-based resin, and an inorganic filler surface-treated with epoxy silane.
Claims12
An insulating film comprising:
- a first layer comprising an epoxy-based resin, a cyanate ester-based resin and an inorganic filler surface-treated with phenylaminosilane;
- and
- a second layer comprising an epoxy-based resin, a phenol-based resin and an inorganic filler surface-treated with epoxysilane.
Dependencies are inferred from the claim text.