H05K 1/0366
Reinforced
Official title: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
H05K1/0366 (Reinforced) appears on 1,305 US grants and 1,445 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,305
- Published applications
- 1,445
- Assignees
- 578
- Inventors
- 3,048
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 11 | 0 |
| 1984 | 9 | 0 |
| 1985 | 15 | 0 |
| 1986 | 10 | 0 |
| 1987 | 18 | 0 |
| 1988 | 16 | 0 |
| 1989 | 22 | 0 |
| 1990 | 22 | 0 |
| 1991 | 24 | 0 |
| 1992 | 17 | 0 |
| 1993 | 16 | 0 |
| 1994 | 15 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 13 | 0 |
| 1998 | 26 | 0 |
| 1999 | 31 | 0 |
| 2000 | 21 | 0 |
| 2001 | 24 | 11 |
| 2002 | 21 | 33 |
| 2003 | 28 | 38 |
| 2004 | 30 | 50 |
| 2005 | 21 | 48 |
| 2006 | 25 | 40 |
| 2007 | 19 | 55 |
| 2008 | 25 | 49 |
| 2009 | 25 | 71 |
| 2010 | 35 | 58 |
| 2011 | 42 | 57 |
| 2012 | 55 | 56 |
| 2013 | 41 | 45 |
| 2014 | 33 | 69 |
| 2015 | 38 | 80 |
| 2016 | 50 | 72 |
| 2017 | 55 | 52 |
| 2018 | 45 | 48 |
| 2019 | 49 | 59 |
| 2020 | 45 | 68 |
| 2021 | 51 | 54 |
| 2022 | 47 | 73 |
| 2023 | 35 | 56 |
| 2024 | 44 | 75 |
| 2025 | 56 | 67 |
| 2026 | 27 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board22 Sep 2026US 12,742,047 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition and product thereof15 Sep 2026US 12,735,563 B2Elite Electronic Material (Zhongshan) Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Material selection assistance device, circuit board manufacturing method, circuit board core, and circuit board1 Oct 2026US 2026/0304614 A1
- Circuit board and method for manufacturing the same and semiconductor package24 Sep 2026US 2026/0293732 A1LG Innotek Co., Ltd.
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board17 Sep 2026US 2026/0275100 A1Panasonic Intellectual Property Management Co., Ltd.
- Prepreg, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264370 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture188US 5,079,069 AZycon Corporation · 1992
- Polycarboxy/polyol fiberglass binder of low pH184US 6,331,350 B1Johns Manville International, Inc. · 2001
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture153US 5,155,655 AZycon Corporation · 1992