Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture

A method for forming a capacitor laminate having laminated components and relatively high capacitance, comprising the steps of

• selecting a dielectric sheet having an initial thickness of not more than about 4 mils,
• selecting two conductive foils each having one surface treated side with surface roughness or surface variation just sufficient to promote adhesion of the one sides to the dielectric sheet in a resulting capacitor laminate,
• forming the capacitor laminate with the one surface treated sides of the conductive foils in intimate contact with opposite sides of the dielectric sheet whereby the dielectric sheet has a minimum thickness between all opposing surface portions of the conductive foils for maintaining adhesion and for developing enhanced capacitive integrity of the capacitor laminate
• the dielectric sheet having an initial thickness of no more than about 2 mils, and
• the surface roughness or surface variation on the one surface treated side of each conductive foil being selected for maintaining a minimum thickness of at least about 0.5 mils between all opposing surface portions of the conductive foils in the formed capacitor laminate.

A capacitor laminate formed from laminated components and having relatively high capacitance and comprising

• a dielectric sheet having an initial thickness of no more than about 4 mils,
• two conductive foils each having one surface treated side with surface roughness or surface variation just sufficient to promote adhesion of the one sides to the dielectric sheet in a resulting capacitor laminate,
• the capacitor laminate being formed from the dielectric sheet and the two conductive foils with the surface treated sides of the conductive foils in intimate contact with opposite sides of the dielectric sheet whereby the dielectric sheet is a minimum thickness between all opposing surface portions of the conductive foils for maintaining adhesion and for developing enhanced capacitive integrity of the capacitor laminate and
• the capacitor laminate being adapted for use with multiple devices respectively coupled to different portions of the capacitor laminate and the two conductive foils each have sufficient conductivity for facilitating operation of the devices by providing each device with total capacitance including a proportional portion of the capacitor laminate and borrowed or shared capacitance from the other portions of the capacitor laminate.

A capacitor laminate formed form laminated components and having relatively high capacitance and comprising

• a dielectric sheet having an initial thickness of no more than about 4 mils,
• two conductive foils each having one surface treated side with surface roughness or surface variation just sufficient to promote adhesion of the one sides to the dielectric sheet in a resulting capacitor laminate,
• the capacitor laminate being formed from the dielectric sheet and the two conductive foils with the surface treated sides of the conductive foils in intimate contact with opposite sides of the dielectric sheet whereby the dielectric sheet is a minimum thickness between all opposing surface portions of the conductive foils for maintaining adhesion and for developing enhanced capacitive integrity of the capacitor laminate and,
• the dielectric sheet having an initial thickness of no more than about 2 mils.

A printed circuit board (PCB) comprising at least one capacitor laminate extending through a substantial area of the PCB and multiple devices respectively coupled to different portions of each capacitor laminate, each capacitor laminate including

• a dielectric sheet having an initial thickness of no more than about 4 mils, and
• two conductive foils each having one surface treated side with surface roughness or surface variation just sufficient to promote adhesion of the one sides to the dielectric sheet in a resulting capacitor laminate,
• the two conductive foils having sufficient conductivity for facilitating random operation of the devices by providing each device with total capacitance including a proportional portion of the capacitor laminate and borrowed or shared capacitance from other portions of the capacitor laminate,
• the other sides of the conductive foils also being surface treated to promote adhesion of the capacitor laminates within the PCB,
• each capacitor laminate being formed from one dielectric sheet and two conductive foils with the surface treated sides of the conductive foils in intimate contact with opposite sides of the dielectric sheet whereby the dielectric sheet is a minimum thickness between all opposing surface portions of the conductive foils for enhanced capacitive integrity of the capacitor laminate.