Resin composition and product thereof
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsZhilong Hu, Changyuan Li, Xiang Xiong, Hezong Zhang
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AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsZhilong Hu, Changyuan Li, Xiang Xiong, Hezong Zhang
Estimating the term…
A resin composition is disclosed, comprising 100 parts by weight of a copolymer of phenylvinylsilane and alkenyl compound and 20 parts by weight to 100 parts by weight of a vinylbenzyl-terminated phenolic resin; wherein the raw material of the copolymer of phenylvinylsilane and alkenyl compound comprises a phenylvinylsilane and an alkenyl compound, based on a total weight of the phenylvinylsilane and the alkenyl compound being 100 parts by weight, the phenylvinylsilane is 80 parts by weight to 98 parts by weight, and the alkenyl compound is 2 parts by weight to 20 parts by weight. The resin composition can be made into a product such as a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator.
A resin composition, based on part by weight, comprising:
Dependencies are inferred from the claim text.