H05K 1/036
Multilayers with layers of different types
Official title: {Multilayers with layers of different types}
H05K1/036 (Multilayers with layers of different types) appears on 682 US grants and 777 published applications in this corpus.
Search patents in H05K- Granted patents
- 682
- Published applications
- 777
- Assignees
- 386
- Inventors
- 1,971
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 15 | 0 |
| 1988 | 8 | 0 |
| 1989 | 10 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 17 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 9 | 0 |
| 1996 | 11 | 0 |
| 1997 | 9 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 4 |
| 2002 | 8 | 19 |
| 2003 | 13 | 20 |
| 2004 | 18 | 12 |
| 2005 | 9 | 17 |
| 2006 | 9 | 23 |
| 2007 | 8 | 20 |
| 2008 | 5 | 17 |
| 2009 | 10 | 30 |
| 2010 | 5 | 27 |
| 2011 | 12 | 22 |
| 2012 | 24 | 22 |
| 2013 | 13 | 20 |
| 2014 | 17 | 39 |
| 2015 | 14 | 41 |
| 2016 | 23 | 38 |
| 2017 | 38 | 28 |
| 2018 | 22 | 37 |
| 2019 | 35 | 45 |
| 2020 | 39 | 50 |
| 2021 | 32 | 52 |
| 2022 | 42 | 55 |
| 2023 | 34 | 45 |
| 2024 | 35 | 43 |
| 2025 | 32 | 28 |
| 2026 | 14 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Rigid-flexible printed circuit board and preparation method therefor25 Aug 2026US 12,720,686 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Micro light-emitting package11 Aug 2026US 12,707,562 B2Ennostar Corporation
- Copper clad laminate and uses of the same28 Jul 2026US 12,696,386 B2Taiwan Union Technology Corporation
- Conductive film and manufacturing method thereof28 Jul 2026US 12,696,387 B2San Fang Chemical Industry Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- High-frequency substrate27 Aug 2026US 2026/0255470 A1Sumitomo Electric Printed Circuits, Inc.
- Printed circuit board27 Aug 2026US 2026/0255477 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Stretchable and foldable electronic devices116US 8,905,772 B2Northwestern University · 2014
- Coextrusion of thermoplastic fluoropolymers with thermoplastic polymers107US 4,677,017 AAusimont, U.S.A., Inc. · 1987
- Flexible circuitized interposer with apertured member and method for making same105US 5,984,691 AInternational Business Machines Corporation · 1999