Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Su KIM, Joung Hun KIM, Sang Kee YOON, Tae Kyung LEE, Jin Uk LEE
Life of this patent
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Abstract
A printed circuit board includes a first insulating layer, a first wiring layer disposed on the first insulating layer, and a first insulating film disposed on the first insulating layer, the first insulating film covering at least a portion of each of an upper surface and a side surface of the first wiring layer conforming to a shape of the first wiring layer. The first insulating layer has a first recess portion around the first wiring layer. A depth of the first recess portion is greater than 0 μm and less than 1.0 μm.
Claims20
A printed circuit board comprising:
- a first insulating layer having a first region and a second region;
- a first wiring layer disposed on the first insulating layer;
- and
- a first insulating film disposed on the first insulating layer, the first insulating film covering at least a portion of each of an upper surface and a side surface of the first wiring layer conforming to a shape of the first wiring layer,
- wherein the first insulating layer has a first recess portion around the first wiring layer, and
- wherein a depth of the first recess portion is greater than 0 μm and less than 1.0 μm.
A printed circuit board comprising:
- a first insulating layer having a first region and a second region;
- a plurality of wirings disposed on the first insulating layer;
- and
- an insulating film disposed on the first insulating layer, the insulating film covering each of the plurality of wirings conforming to a shape of each of the plurality of wirings,
- wherein each of the plurality of wirings includes a first metal portion and a second metal portion disposed on the first metal portion, the second metal portion being thicker than the first metal portion,
- wherein the first metal portion has a width greater than a width of the second metal portion in cross-section, and
- wherein the first insulating layer has a recess portion disposed between the first metal portion of each of at least two adjacent wirings, among the plurality of wirings.
Dependencies are inferred from the claim text.