US 8,905,772 B2Granted

Stretchable and foldable electronic devices

AssigneesThe Board of Trustees of the University of Illinois, Northwestern University

InventorsJohn A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim

Life of this patent

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Abstract

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Claims27

Dependent claims

A stretchable and foldable multilayer electronic device, comprising:

a substrate;
an isolation layer disposed on a portion of the substrate;
a functional layer comprising:
at least one device island;
and
at least one stretchable interconnect coupled to the at least one device island;
wherein at least a portion of the device island is in physical communication with the isolation layer;
and
wherein at least a portion of the stretchable interconnect is not in physical communication with the isolation layer;
one or more neutral mechanical surface adjusting layers;
and
one or more encapsulating layers disposed over the at least one device island,
wherein at least one of said one or more neutral mechanical surface adjusting layers is disposed over said functional layer,
wherein at least one of said one or more neutral mechanical surface adjusting layers of said multilayer electronic device has a property that is spatially inhomogeneous relative to a location in said multilayer electronic device.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/974,963Filed 23 Aug 2013 · continuation
Priority: 5 Mar 2008
Published: US 2014/0140020 A122 May 2014
Granted: 9 Dec 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification33 codes

H05K 1/028
Bendability or stretchability details: bending or folding regions of flexible printed circuits
H05K 1/0283
Bendability or stretchability details: stretchable printed circuits
H05K 1/03
Details: use of materials for the substrate
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out

Family

Application61/033,886Us provisional application · filed 5 Mar 2008
Application61/061,978Us provisional application · filed 16 Jun 2008
Application61/084,045Us provisional application · filed 28 Jul 2008
Application12/398,811Parent of this continuation · filed 5 Mar 2009
US 2014/0140020 A1Pre-grant publication · published 22 May 2014
US 8,552,299 B2Parent of this continuation
US 2010/0002402 A1Published application
US 8,905,772 B2This patent

From the US filing history. Foreign family members aren’t listed.