H05K 1/0393
Flexible materials
Official title: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
H05K1/0393 (Flexible materials) appears on 2,489 US grants and 2,571 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,489
- Published applications
- 2,571
- Assignees
- 1,162
- Inventors
- 6,149
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 9 | 0 |
| 1978 | 10 | 0 |
| 1979 | 3 | 0 |
| 1980 | 10 | 0 |
| 1981 | 12 | 0 |
| 1982 | 11 | 0 |
| 1983 | 7 | 0 |
| 1984 | 12 | 0 |
| 1985 | 11 | 0 |
| 1986 | 17 | 0 |
| 1987 | 27 | 0 |
| 1988 | 24 | 0 |
| 1989 | 23 | 0 |
| 1990 | 33 | 0 |
| 1991 | 37 | 0 |
| 1992 | 38 | 0 |
| 1993 | 50 | 0 |
| 1994 | 51 | 0 |
| 1995 | 46 | 0 |
| 1996 | 35 | 0 |
| 1997 | 47 | 0 |
| 1998 | 37 | 0 |
| 1999 | 42 | 0 |
| 2000 | 34 | 0 |
| 2001 | 44 | 14 |
| 2002 | 47 | 57 |
| 2003 | 42 | 67 |
| 2004 | 51 | 76 |
| 2005 | 51 | 120 |
| 2006 | 46 | 140 |
| 2007 | 55 | 150 |
| 2008 | 61 | 138 |
| 2009 | 77 | 152 |
| 2010 | 67 | 127 |
| 2011 | 68 | 89 |
| 2012 | 80 | 81 |
| 2013 | 67 | 77 |
| 2014 | 58 | 89 |
| 2015 | 62 | 84 |
| 2016 | 86 | 77 |
| 2017 | 76 | 105 |
| 2018 | 83 | 128 |
| 2019 | 121 | 114 |
| 2020 | 122 | 146 |
| 2021 | 107 | 147 |
| 2022 | 106 | 111 |
| 2023 | 87 | 92 |
| 2024 | 87 | 77 |
| 2025 | 63 | 67 |
| 2026 | 36 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Battery monitoring module and flexible printed wiring board15 Sep 2026US 12,738,547 B2Mektec Corporation
- Flexible printed board and flexible printed board connection structure8 Sep 2026US 12,733,096 B2Mektec Corporation
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Pressure sensing system and seat cushion having the pressure sensing system25 Aug 2026US 12,715,392 B2Magna Seating Inc.
- Flexible circuits configured for heat spreading in a wearable display25 Aug 2026US 12,720,667 B2Google Inc.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Fastening system for an electronic circuit board1 Oct 2026US 2026/0298449 A1BEGA Gantenbrink-Leuchten KG
- Component Carrier With Porous Body, and Manufacture Method1 Oct 2026US 2026/0304615 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component carrier, method for manufacturing a component carrier and component carrier assembly1 Oct 2026US 2026/0304627 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Earphone with force sensor for detecting user input24 Sep 2026US 2026/0287446 A1Pixart Imaging Inc.
Most cited
By later US patents
- Transferred flexible integrated circuit464US 6,027,958 AKopin Corporation · 2000
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Marker light utilizing light emitting diodes disposed on a flexible circuit board332US 5,585,783 A1996
- Method of making a biosensor243US 7,073,246 B2Roche Diagnostics Operations, Inc. · 2006