H05K 1/0271
Arrangements for reducing stress or warp in rigid printed circuit boards
Official title: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
H05K1/0271 (Arrangements for reducing stress or warp in rigid printed circuit boards) appears on 2,081 US grants and 2,519 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,081
- Published applications
- 2,519
- Assignees
- 764
- Inventors
- 5,166
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 11 | 0 |
| 1988 | 8 | 0 |
| 1989 | 12 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 18 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 17 | 0 |
| 1997 | 20 | 0 |
| 1998 | 23 | 0 |
| 1999 | 20 | 0 |
| 2000 | 29 | 0 |
| 2001 | 50 | 21 |
| 2002 | 46 | 39 |
| 2003 | 35 | 50 |
| 2004 | 44 | 47 |
| 2005 | 30 | 66 |
| 2006 | 41 | 57 |
| 2007 | 42 | 81 |
| 2008 | 35 | 88 |
| 2009 | 51 | 117 |
| 2010 | 67 | 104 |
| 2011 | 63 | 78 |
| 2012 | 66 | 50 |
| 2013 | 65 | 78 |
| 2014 | 61 | 144 |
| 2015 | 76 | 141 |
| 2016 | 105 | 115 |
| 2017 | 121 | 97 |
| 2018 | 95 | 113 |
| 2019 | 113 | 152 |
| 2020 | 113 | 132 |
| 2021 | 128 | 113 |
| 2022 | 90 | 113 |
| 2023 | 78 | 106 |
| 2024 | 84 | 103 |
| 2025 | 91 | 130 |
| 2026 | 52 | 184 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Methods and apparatus to increase rigidity of printed circuit boards25 Aug 2026US 12,720,673 B2Intel Corporation
- Electronic device25 Aug 2026US 12,720,674 B2Innolux Corporation
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board, circuit board assembly and device including the same17 Sep 2026US 2026/0282210 A1LG Energy Solution, Ltd.
- Circuit board and manufacturing method thereof17 Sep 2026US 2026/0282211 A1Unimicron Technology Corp.
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
Most cited
By later US patents
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- Process for mounting electronic device and semiconductor device167US 6,208,525 B1Hitachi Hokkai Semiconductor, Ltd. · 2001
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998