H05K 1/0201
Thermal arrangements
Official title: {Thermal arrangements, e.g. for cooling, heating or preventing overheating}
H05K1/0201 (Thermal arrangements) appears on 5,895 US grants and 7,116 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,895
- Published applications
- 7,116
- Assignees
- 2,233
- Inventors
- 13,946
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 12 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 6 | 0 |
| 1988 | 16 | 0 |
| 1989 | 25 | 0 |
| 1990 | 32 | 0 |
| 1991 | 26 | 0 |
| 1992 | 28 | 0 |
| 1993 | 20 | 0 |
| 1994 | 35 | 0 |
| 1995 | 33 | 0 |
| 1996 | 38 | 0 |
| 1997 | 47 | 0 |
| 1998 | 66 | 0 |
| 1999 | 74 | 0 |
| 2000 | 62 | 0 |
| 2001 | 84 | 21 |
| 2002 | 69 | 80 |
| 2003 | 65 | 91 |
| 2004 | 76 | 131 |
| 2005 | 73 | 119 |
| 2006 | 89 | 200 |
| 2007 | 90 | 177 |
| 2008 | 93 | 209 |
| 2009 | 110 | 201 |
| 2010 | 115 | 227 |
| 2011 | 158 | 186 |
| 2012 | 164 | 182 |
| 2013 | 144 | 235 |
| 2014 | 148 | 320 |
| 2015 | 188 | 355 |
| 2016 | 285 | 339 |
| 2017 | 327 | 387 |
| 2018 | 352 | 454 |
| 2019 | 424 | 425 |
| 2020 | 393 | 437 |
| 2021 | 367 | 416 |
| 2022 | 332 | 414 |
| 2023 | 335 | 393 |
| 2024 | 350 | 415 |
| 2025 | 320 | 317 |
| 2026 | 186 | 385 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Camera pass-through8 Oct 2026US 2026/0313212 A1Bio-Rad Laboratories, Inc.
- Enhanced thermal management in high-power electronics using phase change materials8 Oct 2026US 2026/0313780 A1Connaught Electronics Ltd.
- Heat dissipation device8 Oct 2026US 2026/0313781 A1ASUSTeK COMPUTER INC.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Fastening system for an electronic circuit board1 Oct 2026US 2026/0298449 A1BEGA Gantenbrink-Leuchten KG
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Signal light unit having heat dissipating function456US 4,729,076 A1988
- Lighting units429US 5,890,794 A1999