H05K 1/0203
Cooling of mounted components
Official title: {Cooling of mounted components (H05K1/0272 takes precedence)}
H05K1/0203 (Cooling of mounted components) appears on 5,030 US grants and 6,211 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,030
- Published applications
- 6,211
- Assignees
- 1,936
- Inventors
- 12,007
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 10 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 10 | 0 |
| 1987 | 4 | 0 |
| 1988 | 11 | 0 |
| 1989 | 17 | 0 |
| 1990 | 21 | 0 |
| 1991 | 19 | 0 |
| 1992 | 17 | 0 |
| 1993 | 16 | 0 |
| 1994 | 25 | 0 |
| 1995 | 23 | 0 |
| 1996 | 24 | 0 |
| 1997 | 33 | 0 |
| 1998 | 45 | 0 |
| 1999 | 51 | 0 |
| 2000 | 45 | 0 |
| 2001 | 67 | 18 |
| 2002 | 52 | 59 |
| 2003 | 48 | 77 |
| 2004 | 67 | 106 |
| 2005 | 61 | 105 |
| 2006 | 72 | 170 |
| 2007 | 84 | 155 |
| 2008 | 79 | 188 |
| 2009 | 92 | 178 |
| 2010 | 98 | 202 |
| 2011 | 141 | 174 |
| 2012 | 144 | 157 |
| 2013 | 126 | 203 |
| 2014 | 130 | 282 |
| 2015 | 169 | 305 |
| 2016 | 250 | 294 |
| 2017 | 286 | 337 |
| 2018 | 305 | 396 |
| 2019 | 363 | 361 |
| 2020 | 336 | 374 |
| 2021 | 325 | 363 |
| 2022 | 299 | 362 |
| 2023 | 303 | 351 |
| 2024 | 297 | 365 |
| 2025 | 282 | 274 |
| 2026 | 163 | 355 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 1/0204Using means for thermal conduction connection in the thickness direction of the1,866
- H05K 1/0209External configuration of printed circuit board adapted for heat dissipation1,063
- H05K 1/021Components thermally connected to metal substrates or heat-sinks by insert mounting540
- H05K 1/0207Using internal conductor planes parallel to the surface for thermal conduction357
Recent patents
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Camera pass-through8 Oct 2026US 2026/0313212 A1Bio-Rad Laboratories, Inc.
- Enhanced thermal management in high-power electronics using phase change materials8 Oct 2026US 2026/0313780 A1Connaught Electronics Ltd.
- Heat dissipation device8 Oct 2026US 2026/0313781 A1ASUSTeK COMPUTER INC.
- Systems and methods for leakage protection1 Oct 2026US 2026/0299655 A1Quanta Computer Inc.
- Thermal cooling solutions for variable height devices in an optical modem clamshell assembly1 Oct 2026US 2026/0304592 A1Ciena Corporation
Most cited
By later US patents
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Signal light unit having heat dissipating function456US 4,729,076 A1988
- Lighting units429US 5,890,794 A1999
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991