H05K 1/0207
Using internal conductor planes parallel to the surface for thermal conduction
Official title: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}
H05K1/0207 (Using internal conductor planes parallel to the surface for thermal conduction) appears on 357 US grants and 400 published applications in this corpus.
Search patents in H05K- Granted patents
- 357
- Published applications
- 400
- Assignees
- 271
- Inventors
- 947
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 9 | 1 |
| 2002 | 3 | 7 |
| 2003 | 7 | 3 |
| 2004 | 4 | 7 |
| 2005 | 3 | 4 |
| 2006 | 6 | 7 |
| 2007 | 2 | 7 |
| 2008 | 4 | 11 |
| 2009 | 7 | 11 |
| 2010 | 7 | 19 |
| 2011 | 8 | 10 |
| 2012 | 10 | 9 |
| 2013 | 9 | 14 |
| 2014 | 14 | 23 |
| 2015 | 14 | 31 |
| 2016 | 23 | 33 |
| 2017 | 23 | 19 |
| 2018 | 23 | 14 |
| 2019 | 18 | 27 |
| 2020 | 25 | 20 |
| 2021 | 16 | 20 |
| 2022 | 23 | 33 |
| 2023 | 22 | 27 |
| 2024 | 22 | 13 |
| 2025 | 17 | 13 |
| 2026 | 4 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension2 Dec 2025US 12,490,371 B2
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Light emitting device13 Aug 2026US 2026/0237962 A1FUJIFILM Business Innovation Corp.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Substrate carrier and motor vehicle23 Jul 2026US 2026/0214788 A1Hella GmbH & Co. KGaA
- Display device and display panel2 Jul 2026US 2026/0190692 A1LG Display Co., Ltd.
Most cited
By later US patents
- Chip-carrier substrates111US 4,509,096 ASmiths Industries Public Limited Company · 1985
- Method of manufacture of ceramic composite wiring structures for semiconductor devices100US 7,047,637 B22006
- High-frequency multilayer printed circuit board86US 4,812,792 ATRW Inc. · 1989
- Ceramic composite wiring structures for semiconductor devices and method of manufacture86US 6,323,549 B12001
- Circuit board having improved thermal radiation82US 5,500,785 AFuji Xerox Co., Ltd. · 1996