Ceramic composite wiring structures for semiconductor devices and method of manufacture

A composite structure for use with at least one semiconductor device, comprising:

• means for providing an electrical conduction, said electrical conduction means having an exterior major surface and an interior major surface;
• said exterior major surface of said electrical conduction means being capable of having the at least one semiconductor device mounted thereon for electrical connection thereto,
• means for providing electrical insulation, said electrical insulation means having a major surface bonded to said interior major surface of said conduction means;
• a conductive network made up of at least one conductive wire segment embedded within said electrical insulation means, said at least one wire segment being electrically connected to said electrical conduction means;
• and
• means for providing thermal distribution, said thermal distribution means embedded within said electrical insulation means and electrically isolated from said conduction means and said conductive network, said thermal distribution means capable of efficiently dissipating heat generated during operation of the at least one semiconductor device.

A composite structure for the management of electrical and thermal conduction from at least one semiconductor device, comprising:

• an electrical interconnection network including a plurality of interconnected conductive components formed into a predetermined wiring circuit;
• at least one of said conductive components used to make external electrical connection with the at least one semiconductor device;
• an electrically insulating dielectric member, said dielectric member fully encompassing said electrical interconnection network, except for those portions of said at least one of said conductive components used to make said external electrical connection to the at least one semiconductor device;
• said dielectric member being formed in-situ upon and around said electrical interconnection network, thereby embedding said predetermined wiring circuit within said dielectric member at a temperature less than 475 C.;
• wherein heat transfer can take place between the at least one semiconductor device and an external reservoir.

A composite structure for use with at least one semiconductor devices, comprising:

• a first conductive member having a surface upon which the at least one semiconductor device is mounted for electrical connection thereto,
• a dielectric member, said dielectric member having a major surface bonded to said first conductive member;
• a conductive network made up of at least one conductive wire segment embedded within said ceramic member, said at least one wire segment being electrically connected to said first conductive member;
• a thermal distribution network embedded within said ceramic member and electrically isolated from said conductive network, said thermal distribution network capable of efficiently dissipating heat generated during operation of the semiconductor device;
• and
• a second conductive member, said second conductive member bonded to said dielectric member on a side thereof opposite said first conductive member.

A composite structure for management of electrical and thermal conduction from at least one semiconductor device, comprising:

• a composite, with at least one electrical conductor forming a portion of an electrical network and at least one thermal conductor forming a part of a thermal network, said electrical conductor bonded to an electrically insulating dielectric member, and said dielectric member encompassing the electrical and thermal networks;
• said electrical and thermal conductors and networks formed thereby being arranged within said dielectric member in electrical isolation from each other;
• at least one capacitor embedded within said dielectric member and being electrically connected between said electrical network and another electrical conductor;
• and
• the structure as a whole being constructed and arranged to enable heat transfer from the electrical network and the semiconductor device to and through the thermal network.

A composite structure for management of electrical and thermal conduction from at least one semiconductor device, comprising:

• a composite, with at least one electrical conductor forming a portion of an electrical network and at least one thermal conductor forming a part of a thermal network, said electrical conductor bonded to an electrically insulating dielectric member, and said dielectric member encompassing the electrical and thermal networks;
• said electrical and thermal conductors and networks formed thereby being arranged within said dielectric member in electrical isolation from each other;
• said electrical and thermal networks being made up of curved components;
• and
• the structure as a whole being constructed and arranged to enable heat transfer from the electrical network and the semiconductor device to and through the thermal network.

A composite structure for management of electrical and thermal conduction from at least one semiconductor device, comprising:

• a composite, with at least one electrical conductor forming a portion of an electrical network and at least one thermal conductor forming a part of a thermal network, said electrical conductor bonded to an electrically insulating dielectric member, and said dielectric member encompassing the electrical and thermal networks;
• said electrical and thermal conductors and networks formed thereby being arranged within said dielectric member in electrical isolation from each other;
• a support structure, said electrical and thermal networks being secured to said support structure;
• and
• the composite structure as a whole being constructed and arranged to enable heat transfer from the electrical network and the semiconductor device to and through the thermal network.

A composite structure for management of electrical and thermal conduction from at least one semiconductor device, comprising:

• a composite, with at least one electrical conductor forming a portion of an electrical network and at least one thermal conductor forming a part of a thermal network, said electrical conductor bonded to an electrically insulating dielectric member, and said dielectric member encompassing the electrical and thermal networks;
• said electrical and thermal conductors and networks formed thereby being arranged within said dielectric member in electrical isolation from each other;
• said thermal network being made up of at least one heat sink, portions of said heat sink being operably connected to said at least one electrical conductor;
• and
• the structure as a whole being constructed and arranged to enable heat transfer from the electrical network and the semiconductor device to and through the thermal network.

A composite structure for use with at least one semiconductor device, comprising:

• means for providing an electrical conduction, said electrical conduction means having an exterior major surface and an interior major surface;
• said exterior major surface of said electrical conduction means being capable of having the at least one semiconductor device mounted thereon for electrical connection thereto,
• means for providing electrical insulation, said electrical insulation means is ceramic and having a major surface bonded to said interior major surface of said electrical conduction means;
• a conductive network made up of at least one conductive wire segment embedded within said ceramic electrical insulation means, said at least one wire segment being electrically connected to said electrical conduction means;
• and
• said conductive network being made up of components which are coated with an organic resin.

A composite structure for use with at least one semiconductor device, comprising:

• means for providing an electrical conduction, said electrical conduction means having an exterior major surface and an interior major surface;
• said exterior major surface of said electrical conduction means being capable of having the at least one semiconductor device mounted thereon for electrical connection thereto,
• means for providing electrical insulation, said electrical insulation means is organo-ceramic and having a major surface bonded to said interior major surface of said electrical conduction means;
• a conductive network made up of at least one conductive wire segment embedded within said organo-ceramic electrical insulation means, said at least one wire segment being electrically connected to said organo-ceramic electrical conduction means;
• and
• said conductive network is made up of components which are coated with an organic resin.