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US 12,548,705 B2Granted
Integrated voltage regulator
AssigneeNavitas Semiconductor Limited
InventorsHao Sun, Zhen Zhou
Life of this patent
Estimating the term…
Abstract
An integrated voltage regulator comprises a plurality of semiconductor devices and a circuit board including a plurality of thermally conductive inlays. At least one of the plurality of electronic devices is thermally coupled to at least one of the plurality of thermally conductive inlays. A substrate is thermally coupled to the circuit board and to the plurality of thermally conductive inlays.
Claims18
An integrated voltage regulator comprising:
- a plurality of electronic devices;
- a circuit board including a plurality of thermally conductive inlays, the circuit board including a first surface opposite a second surface, wherein each of the plurality of thermally conductive inlays extend from the first surface to the second surface, wherein at least one of the plurality of electronic devices is thermally coupled to at least one of the plurality of thermally conductive inlays at the first surface;
- and
- a substrate thermally coupled to the second surface of the circuit board and to the plurality of thermally conductive inlays.
1 more element
An electronic assembly comprising:
- a circuit board including a thermally conductive inlay that extends through a thickness of the circuit board,
- a semiconductor device positioned within an electronic package that is attached to a top surface of the circuit board and thermally coupled to the thermally conductive inlay;
- a thermal interface material positioned across at least a portion of a bottom surface of the circuit board;
- and
- a substrate thermally coupled to the circuit board and to the thermally conductive inlay via the thermal interface material.
2 more elements
A method of forming an electronic assembly comprising:
- forming a circuit board;
- forming an aperture in the circuit board;
- positioning a thermal inlay within the aperture and securing the inlay within the aperture, wherein the thermal inlay extends through a thickness of the circuit board;
- attaching an electronic package to a top surface of the circuit board and thermally coupling the electronic package to the thermal inlay;
- attaching a thermal interface material to a bottom surface of the circuit board;
- and
- attaching a substrate to the thermal interface material and thermally coupling the substrate to the circuit board and to the thermal inlay.
4 more elements
Dependencies are inferred from the claim text.