Efficient thermal management for vertical power delivery

A PCB assembly comprising:

• a PCB comprising a first thermally conductive structure;
• a first heat generating component connected to the PCB and vertically disposed with respect to the PCB, wherein the PCB is disposed on a first side of the first heat generating component, and wherein the first thermally conductive structure is directly contacting the first side of the heat generating component;
• a second thermally conductive structure directly contacting a second side of the first heat generating component;
• and
• a heat sink disposed between the first thermally conductive structure and the second thermally conductive structure,
• wherein the heat sink comprises a first planar portion, a second planar portion, and fins extending therebetween,
• wherein the first thermally conductive structure is configured to draw heat from the first side of the first heat generating component and conduct the heat from the first side of the first heat generating component laterally and cross-sectionally through the first thermally conductive structure toward the first planar portion of the heat sink,
• wherein the second thermally conductive structure is disposed fully below a surface of the second side of the first heat generating component and fully below the heat sink,
• wherein the second thermally conductive structure is configured to draw heat from the second side of the first heat generating component and conduct the heat from the second side of the first heat generating component laterally and cross-sectionally through the second thermally conductive structure toward the second planar portion of the heat sink, and
• wherein the heat sink is configured to dissipate the heat from the first side of the first heat generating component and the heat from the second side of the first heat generating component.

A method of manufacturing a PCB assembly comprising:

• providing a PCB, wherein the PCB comprises a first thermally conductive structure;
• connecting a first heat generating component to the PCB, wherein the first heat generating component is vertically disposed with respect to the PCB, wherein the PCB is disposed on a first side of the first heat generating component, and wherein the first thermally conductive structure is directly contacting the first side of the heat generating component;
• disposing a second thermally conductive structure on a second side of the heat generating component such that the second thermally conductive structure is directly contacting the second side of the heat generating component;
• and
• attaching a heat sink between the first thermally conductive structure and the second thermally conductive structure,
• wherein the heat sink comprises a first planar portion, a second planar portion, and fins extending therebetween,
• wherein the first thermally conductive structure is configured to draw heat from the first side of the first heat generating component and conduct the heat from the first side of the first heat generating component laterally and cross-sectionally through the first thermally conductive structure toward the first planar portion of the heat sink,
• wherein the second thermally conductive structure is disposed fully below a surface of the second side of the first heat generating component and fully below the heat sink,
• wherein the second thermally conductive structure is configured to draw heat from the second side of the first heat generating component and conduct the heat from the second side of the first heat generating component laterally and cross-sectionally through the second thermally conductive structure toward the second planar portion of the heat sink, and
• wherein the heat sink is configured to dissipate the heat from the first side of the first heat generating component and the heat from the second side of the first heat generating component.