H05K 1/0204
Using means for thermal conduction connection in the thickness direction of the
Official title: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}
H05K1/0204 (Using means for thermal conduction connection in the thickness direction of the) appears on 1,866 US grants and 2,230 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,866
- Published applications
- 2,230
- Assignees
- 963
- Inventors
- 4,924
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 14 | 0 |
| 1996 | 13 | 0 |
| 1997 | 19 | 0 |
| 1998 | 28 | 0 |
| 1999 | 28 | 0 |
| 2000 | 21 | 0 |
| 2001 | 34 | 11 |
| 2002 | 35 | 39 |
| 2003 | 29 | 38 |
| 2004 | 37 | 55 |
| 2005 | 36 | 58 |
| 2006 | 30 | 71 |
| 2007 | 41 | 68 |
| 2008 | 31 | 90 |
| 2009 | 41 | 90 |
| 2010 | 50 | 108 |
| 2011 | 65 | 75 |
| 2012 | 58 | 62 |
| 2013 | 61 | 74 |
| 2014 | 59 | 105 |
| 2015 | 63 | 107 |
| 2016 | 79 | 112 |
| 2017 | 103 | 111 |
| 2018 | 86 | 117 |
| 2019 | 110 | 118 |
| 2020 | 109 | 106 |
| 2021 | 100 | 115 |
| 2022 | 94 | 109 |
| 2023 | 86 | 105 |
| 2024 | 105 | 121 |
| 2025 | 77 | 89 |
| 2026 | 55 | 76 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Heat dissipating assembly for circuit15 Sep 2026US 12,739,964 B2Schneider Electric (China) Co., Ltd.
- System for attaching a thermal interface material to a heat sink8 Sep 2026US 12,733,106 B2Dell Products L. P.
- Camera pass-through8 Oct 2026US 2026/0313212 A1Bio-Rad Laboratories, Inc.
- Fixing structure for electronic module and electronic module1 Oct 2026US 2026/0304595 A1Shindengen Electric Manufacturing Co., Ltd.
- System for Attaching a Thermal Interface Material to a Heat Sink24 Sep 2026US 2026/0292996 A1Dell Products L. P.
- Cooling structure for electronic component10 Sep 2026US 2026/0271238 A1Sea Sonic Electronics Co., Ltd.
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Thermally protected LED array337US 5,785,418 A1998
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002