H05K 1/0206
By printed thermal vias
Official title: {by printed thermal vias}
H05K1/0206 (By printed thermal vias) appears on 1,043 US grants and 1,235 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,043
- Published applications
- 1,235
- Assignees
- 615
- Inventors
- 2,859
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 10 | 0 |
| 1996 | 10 | 0 |
| 1997 | 14 | 0 |
| 1998 | 18 | 0 |
| 1999 | 23 | 0 |
| 2000 | 13 | 0 |
| 2001 | 25 | 8 |
| 2002 | 23 | 30 |
| 2003 | 21 | 28 |
| 2004 | 25 | 34 |
| 2005 | 20 | 36 |
| 2006 | 21 | 45 |
| 2007 | 25 | 44 |
| 2008 | 21 | 66 |
| 2009 | 30 | 67 |
| 2010 | 37 | 67 |
| 2011 | 37 | 46 |
| 2012 | 36 | 43 |
| 2013 | 38 | 42 |
| 2014 | 41 | 58 |
| 2015 | 33 | 60 |
| 2016 | 43 | 62 |
| 2017 | 61 | 50 |
| 2018 | 39 | 53 |
| 2019 | 47 | 48 |
| 2020 | 45 | 46 |
| 2021 | 40 | 46 |
| 2022 | 40 | 59 |
| 2023 | 51 | 47 |
| 2024 | 45 | 68 |
| 2025 | 43 | 46 |
| 2026 | 24 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Power converter package with copper-bar thermally-enhanced interposers to cooling fins1 Sep 2026US 12,727,129 B2Hong Kong Applied Science and Technology Research Institute Company Limited
- Multilayer circuit board, drive control device, and motor unit for electric power steering25 Aug 2026US 12,719,339 B2Mitsubishi Electric Corporation
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Camera pass-through8 Oct 2026US 2026/0313212 A1Bio-Rad Laboratories, Inc.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Substrate assembly23 Jul 2026US 2026/0214784 A1Furukawa Electric Co., Ltd.
- Circuit board23 Jul 2026US 2026/0214785 A1Lite-On Technology Corporation
- Substrate carrier and motor vehicle23 Jul 2026US 2026/0214788 A1Hella GmbH & Co. KGaA
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Thermally protected LED array337US 5,785,418 A1998
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002