Substrate assembly
AssigneeFurukawa Electric Co., Ltd.
InventorsYuta ISHIGE, Wataru YOSHIDA, Kazuya NAGASHIMA, Hideyuki NASU
Life of this patent
Estimating the term…
Loading patent…
AssigneeFurukawa Electric Co., Ltd.
InventorsYuta ISHIGE, Wataru YOSHIDA, Kazuya NAGASHIMA, Hideyuki NASU
Estimating the term…
A substrate assembly includes: a substrate configured to fix an optical transceiver, the substrate including a first surface facing a first direction and a second surface facing an opposite direction on an opposite side of the first surface, wherein the optical transceiver includes a first electrical interface and a heat dissipation portion, and the first electrical interface and the heat dissipation portion are fixed to the substrate while facing the opposite direction and are arranged side by side with each other in a direction intersecting the first direction; a first heat dissipation mechanism including a first part that is adjacent to the heat dissipation portion in the first direction in a state where the optical transceiver is fixed to the substrate and that is thermally connected to the heat dissipation portion; and a thermal conductive member disposed between the heat dissipation portion and the first part.
A substrate assembly comprising:
Dependencies are inferred from the claim text.