System for attaching a thermal interface material to a heat sink
AssigneeDell Products L.P.
InventorsEnoch Chen, Ping-Sheng Kao, Ryan Lee, Travis C. North
Life of this patent
Estimating the term…
Loading patent…
AssigneeDell Products L.P.
InventorsEnoch Chen, Ping-Sheng Kao, Ryan Lee, Travis C. North
Estimating the term…
A system for attaching a thermal interface material (TIM) to a heat sink positioned on a base layer, the heat sink having a heat sink length and a heat sink width, the system including a plurality of treated sections of the base layer around at least a portion of a perimeter of the heat sink, wherein each treated section of the plurality of treated sections comprises a width, and wherein one or more of the width and the surface roughness of each treated section of the plurality of treated sections is based on the TIM, and wherein the plurality of treated sections form a continuous roughness edge, wherein a portion of the TIM extends onto the roughness edge around the heat sink.
A system for attaching a thermal interface material (TIM) to a heat sink positioned on a base layer, the heat sink having a heat sink length and a heat sink width, the system comprising:
Dependencies are inferred from the claim text.