Cooling structure for electronic component

Abstract

A cooling structure for electronic component includes an electronic component, a heat sink, and a circuit board. The electronic component includes a package casing, a plurality of pins exposed from the package casing, and a top-mounted heat sink exposed from the package casing. The heat sink is formed with a space for accommodating the electronic component and an injection channel communicating with the space. A physical thermal conducting medium is injected into the space through the injection channel, and the physical thermal conducting medium facilitates thermal conduction between the top heat sink and the heat sink. The circuit board is provided with a plurality of first copper coils for bonding the pins, and a second copper coil for bonding the heat sink. Further, the electronic component in the invention can be implemented in multiple configurations, and the electronic components can be arranged in parallel.

Dependencies are inferred from the claim text.