Heat dissipation device

Abstract

A heat dissipation device provided is adapted to be installed on a circuit board. The circuit board includes a heat generation element. The heat dissipation device includes a heat dissipation module and multiple second electrical contacts. The heat dissipation module is adapted to correspond to the heat generation element and be fixed on the circuit board. The heat dissipation module has multiple first electrical contacts. The second electrical contacts are adjacent to the heat generation element and disposed on the circuit board. When the heat dissipation device is installed on the circuit board, the first electrical contacts directly contact the second electrical contacts.

Dependencies are inferred from the claim text.