H05K 1/021
Components thermally connected to metal substrates or heat-sinks by insert mounting
Official title: {Components thermally connected to metal substrates or heat-sinks by insert mounting}
H05K1/021 (Components thermally connected to metal substrates or heat-sinks by insert mounting) appears on 540 US grants and 595 published applications in this corpus.
Search patents in H05K- Granted patents
- 540
- Published applications
- 595
- Assignees
- 350
- Inventors
- 1,380
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 2 | 0 |
| 2000 | 8 | 0 |
| 2001 | 15 | 1 |
| 2002 | 9 | 7 |
| 2003 | 5 | 11 |
| 2004 | 13 | 13 |
| 2005 | 10 | 13 |
| 2006 | 8 | 16 |
| 2007 | 8 | 23 |
| 2008 | 15 | 20 |
| 2009 | 5 | 20 |
| 2010 | 12 | 31 |
| 2011 | 18 | 23 |
| 2012 | 23 | 22 |
| 2013 | 21 | 23 |
| 2014 | 10 | 33 |
| 2015 | 26 | 38 |
| 2016 | 27 | 18 |
| 2017 | 20 | 29 |
| 2018 | 23 | 14 |
| 2019 | 37 | 27 |
| 2020 | 25 | 36 |
| 2021 | 32 | 36 |
| 2022 | 27 | 33 |
| 2023 | 30 | 33 |
| 2024 | 19 | 33 |
| 2025 | 35 | 17 |
| 2026 | 9 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Lens for retrofitting a lighting system with LED lights21 Jul 2026US 12,690,120 B2
- Thermal conduction—electrical conduction isolated circuit board with ceramic substrate and power transistor embedded23 Jun 2026US 12,666,527 B2ICP Technology Co., Ltd.
- Heat sink component terminations5 May 2026US 12,621,924 B2KYOCERA AVX Components Corporation
- Power module with heat sink and cooling jacket1 Oct 2026US 2026/0304714 A1STMicroelectronics International N. V.
- A cooling arrangement for an electronic device10 Sep 2026US 2026/0271229 A1
- Heat Sink Component Terminations20 Aug 2026US 2026/0247521 A1KYOCERA AVX Components Corporation
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Electronic device and metal heat dissipation9 Jul 2026US 2026/0197931 A1Wistron Neweb Corp.
Most cited
By later US patents
- L.E.D. thermal management341US 6,428,189 B1Relume Corporation · 2002
- Heatsinking electronic devices170US 6,999,318 B2Honeywell International Inc. · 2006
- Methods of making multi-tier laminate substrates for electronic device packaging159US 5,798,014 AHestia Technologies, Inc. · 1998
- LED mounting system117US 6,582,100 B1Relume Corporation · 2003
- Method of manufacturing a circuit board91US 4,993,148 AMitsubishi Denki Kabushiki Kaisha · 1991