Method of manufacturing a circuit board
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKohei Adachi, Mitsuyuki Takada, Atsushi Endo, Eishi Gofuku, Hayato Takasago
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Abstract
A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.
Claims12
A method of manufacturing a circuit board, comprising the steps of:
- preparing a metal substrate having a major surface;
- forming an insulating layer selectively, with at least one open space therein, on the major surface of said metal substrate, to expose the major surface of said metal substrate to enable at least an electronic component to be mounted in the at least one open space of said insulating layer;
- and
- forming a conductor layer selectively, with at least one open space therein, on said insulating layer in accordance with a predetermined pattern, said conductor layer being formed to enable said electronic component to be at least electrically connected.
A method of manufacturing a circuit board, comprising the steps of:
- preparing a metal substrate having a major surface;
- forming an insulating layer selectively with at least one open space therein, on the major surface of said metal substrate;
- forming a metal layer in the at least one open space of said insulating layer to at least fill an exposed portion of the major surface of said metal substrate, said metal layer being formed to enable at least an electronic component to be mounted thereon;
- and
- forming a conductor layer selectively, with at least one open space therein, on said insulating layer and said metal layer in accordance with a predetermined pattern, said conductor layer being formed to enable said electronic component to be at least electrically connected.
Dependencies are inferred from the claim text.