A cooling arrangement for an electronic device

Abstract

A cooling arrangement (1) for an electronic device (2) comprising a circuit board (3), said cooling arrangement (1) comprising a housing. The housing comprises: a first housing member (4) and a second housing member (5), said first (4) and second (5) housing members jointly defining an inner cavity (6) for accommodating said circuit board (3). The first housing member (4) is provided with external heat transfer fins (14) protruding from an outside of the housing. The cooling arrangement (1) further comprises a first plate (7) sandwiched between an inner surface of the first housing member (4) and the circuit board (3). The first plate (7) and/or said first housing member (4) are provided with one or more first recesses such that at least one first fluid channel (8) is defined by the first plate (7) and the inner surface of the first housing member (4). Also, the cooling arrangement (1) comprises a pump (9) configured to circulate a heat transfer liquid through at least the one or more first fluid channels (8).

Dependencies are inferred from the claim text.